BaTiO3 Films by Low-Temperature Hydrothermal Techniques for Next Generation Packaging Applications
Balaraman, D, Raj, P M, Wan, L, Abothu, I R, Bhattacharya, S, Dalmia, S, Lance, M J, Swaminathan, M, Sacks, M D, Tummala, R R
Published in Journal of electroceramics (01.07.2004)
Published in Journal of electroceramics (01.07.2004)
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Journal Article
Colloidal processing of polymer ceramic nanocomposite integral capacitors
Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., Tummala, R.R.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2003)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2003)
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Journal Article
Processing and Dielectric Properties of Nanocomposite Thin Film "Supercapacitors" for High-Frequency Embedded Decoupling
Raj, P.M., Balaraman, D., Govind, V., Abothu, I.R., Lixi Wan, Gerhardt, R., Swaminathan, M., Tummala, R.
Published in IEEE transactions on components and packaging technologies (01.12.2007)
Published in IEEE transactions on components and packaging technologies (01.12.2007)
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Journal Article
Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems
Muthana, P., Swaminathan, M., Tummala, R., Raj, P.M., Engin, E., Lixi Wan, Balaraman, D., Bhattacharya, S.
Published in 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005 (2005)
Published in 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005 (2005)
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Conference Proceeding
Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications
Windlass, H., Markondeya Raj, P., Balaraman, D., Bhattacharya, S.K., Tummala, R.R.
Published in IEEE transactions on advanced packaging (01.02.2003)
Published in IEEE transactions on advanced packaging (01.02.2003)
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Journal Article
Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors
Markondeya Raj, Pulugurtha, Lee, Baik-Woo, Balaraman, Devarajan, Kang, Nam-Kee, Lance, Michael J., Meyer, Harry, Tummala, Rao R.
Published in Journal of the American Ceramic Society (01.09.2010)
Published in Journal of the American Ceramic Society (01.09.2010)
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Journal Article
Low-cost low actuation voltage copper RF MEMS switches
Balaraman, D., Bhattacharya, S.K., Ayazi, F., Papapolymerou, J.
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)
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Conference Proceeding
Journal Article
Chip-to-chip optoelectronics SOP on organic boards or packages
Gee-Kung Chang, Guidotti, D., Fuhan Liu, Yin-Jung Chang, Zhaoran Huang, Sundaram, V., Balaraman, D., Hegde, S., Tummala, R.R.
Published in IEEE transactions on advanced packaging (01.05.2004)
Published in IEEE transactions on advanced packaging (01.05.2004)
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Journal Article
Embedded decoupling capacitor performance in high speed circuits
Lixi Wan, Raj, P.M., Balaraman, D., Muthana, P., Bhattacharya, S.K., Varadarajan, M., Abothu, I.R., Swaminathan, M., Tummala, R.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Colloidal processing of polymer ceramic nanocomposites for integral capacitors
Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., Tummala, R.R.
Published in Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) (2001)
Published in Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) (2001)
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Conference Proceeding
Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors
Balaraman, D., Jinwoo Choi, Patel, V., Raj, P.M., Abothu, I.R., Bhattacharya, S., Lixi Wan, Swaminathan, M., Tummala, R.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications
Balaraman, D., Raj, P.M., Abothu, R., Bhattacharya, S., Sacks, M., Lance, M., Meyer, H., Swaminathan, M., Tumrnala, R.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes
Abothu, I.R., Raj, P.M., Balaraman, D., Govind, V., Bhattacharya, S., Sacks, M.D., Swaminathan, M., Lance, M.J., Tummala, R.R.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Low-cost embedded capacitor technology with hydrothermal and sol-gel processes
Abothu, I.R., Raj, P.M., Balaraman, D., Sacks, M.D., Bhattacharya, S., Tummala, R.R.
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
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Conference Proceeding
Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates
Lee, K.J., Bhattacharya, S., Varadarajan, M., Lixi Wan, Abothu, I.R., Sundaram, V., Muthana, P., Balaraman, D., Raj, P.M., Swaminathan, M., Sitaraman, S., Tummala, R., Viswanadham, P., Dunford, S., Lauffer, J.
Published in Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005 (2005)
Published in Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005 (2005)
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Conference Proceeding
Processing of polymer-ceramic nanocomposites for system-on-package applications
Windlass, H., Markondeya Raj, P., Balaraman, D., Bhattacharya, S.K., Tummala, R.R.
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding
Novel hydrothermal processing (<100/spl deg/C) of ceramic-polymer composites for integral capacitor applications
Balaraman, D., Markondeya Raj, P., Bhattacharya, S., Tummala, R.R.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
High frequency characteristics of nanocomposite thin film "supercapacitors" and their suitability for embedded decoupling
Markondeya Raj, P., Balaraman, D., Govind, V., Wan, L., Abothu, R., Gerhardt, R., Bhattacharya, S., Swaminathan, M., Tummala, R.
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
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Conference Proceeding
Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)
Balaraman, D., Raj, P.M., Abothu, I.R., Bhattacharya, S., Dalmia, S., Lixi Wan, Swaininathan, M., Tummala, R.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding