Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge
Yang Zhang, Yue Zhang, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2014)
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Journal Article
Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms
Thadesar, Paragkumar A., Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2016)
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Journal Article
Cu-Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies
Li, Ming-Jui, Breeden, Michael, Wang, Victor, Hollin, Jonathan, Linn, Nyi Myat Khine, Winter, Charles H., Kummel, Andrew, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2020)
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Journal Article
Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms
Zhang, Yang, Zhang, Xuchen, Bakir, Muhannad S.
Published in IEEE transactions on electron devices (01.12.2018)
Published in IEEE transactions on electron devices (01.12.2018)
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Journal Article
Quarter-Micron Alignment of Chiplets via Positive Self-Aligned Structures
Yu, Shengtao, Gaylord, Thomas K., Bakir, Muhannad S.
Published in IEEE photonics technology letters (01.11.2023)
Published in IEEE photonics technology letters (01.11.2023)
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Journal Article
Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets
Yu, Shengtao, Gaylord, Thomas K., Bakir, Muhannad S.
Published in IEEE photonics technology letters (01.10.2022)
Published in IEEE photonics technology letters (01.10.2022)
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Journal Article
H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention
Li, Wantong, Manley, Madison, Read, James, Kaul, Ankit, Bakir, Muhannad S., Yu, Shimeng
Published in IEEE transactions on very large scale integration (VLSI) systems (01.10.2023)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.10.2023)
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Journal Article
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips with Compressible Microinterconnects for RF/mm-Wave Chiplet Based Modules
Zheng, Ting, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
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Journal Article
3-D Heterogeneous Integration of RRAM-Based Compute-In-Memory: Impact of Integration Parameters on Inference Accuracy
Kaul, Ankit, Luo, Yandong, Peng, Xiaochen, Manley, Madison, Luo, Yuan-Chun, Yu, Shimeng, Bakir, Muhannad S.
Published in IEEE transactions on electron devices (01.02.2023)
Published in IEEE transactions on electron devices (01.02.2023)
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Journal Article
Fused-Silica Stitch-Chips with Compressible Microinterconnects for Embedded RF/mm-Wave Chiplets
Zheng, Ting, Bakir, Muhannad S.
Published in 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 (19.06.2022)
Published in 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 (19.06.2022)
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Conference Proceeding
Power Delivery Network Benchmarking for Interposer and Bridge-Chip-Based 2.5-D Integration
Zhang, Yang, Hossen, Md Obaidul, Bakir, Muhannad S.
Published in IEEE electron device letters (01.01.2018)
Published in IEEE electron device letters (01.01.2018)
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Journal Article
Grating-assisted-cylindrical-resonant-cavities interlayer coupler
Wan, Congshan, Gaylord, Thomas K, Bakir, Muhannad S
Published in Applied optics. Optical technology and biomedical optics (20.06.2018)
Published in Applied optics. Optical technology and biomedical optics (20.06.2018)
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Journal Article