Characterization of interfacial morphology of low temperature, low pressure Au-Au thermocompression bonding
Goorsky, Mark S., Schjølberg-Henriksen, Kari, Beekley, Brett, Bai, Tingyu, Mani, Karthick, Ambhore, Pranav, Bajwa, Adeel, Malik, Nishant, Iyer, Subramanian S.
Published in Japanese Journal of Applied Physics (01.02.2018)
Published in Japanese Journal of Applied Physics (01.02.2018)
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Journal Article
Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration
Fukushima, Takafumi, Alam, Arsalan, Hanna, Amir, Jangam, Siva Chandra, Bajwa, Adeel Ahmad, Iyer, Subramanian S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2018)
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Journal Article
Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment
Jangam, SivaChandra, Bajwa, Adeel Ahmed, Mogera, Umesh, Ambhore, Pranav, Colosimo, Tom, Chylak, Bob, Iyer, Subramanian
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric
Jangam, SivaChandra, Bajwa, Adeel Ahmed, Thankkappan, Kannan K., Kittur, Premsagar, Iyer, Subramanian Srikantes
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) Assembly
Bajwa, Adeel Ahmad, Jangam, SivaChandra, Pal, Saptadeep, Vaisband, Boris, Irwin, Randall, Goorsky, Mark, Iyer, Subramanian S.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Survival and Outcomes After Robotic Rectal Cancer Surgery – Single Centre Experience
Baig, Mariam, Bajwa, Adeel, Evans, Charles
Published in European journal of surgical oncology (01.11.2019)
Published in European journal of surgical oncology (01.11.2019)
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Journal Article
Feasibility of robotic platform to perform R0 resection for locally advanced multi-visceral pelvic malignancy: an institutional experience on outcomes of robotic pelvic exenteration
Saqib, Sabah Uddin, Raza, Muhammad Zeeshan, Twigg, Jeremy, Altan, Omer, Bajwa, Adeel Ahmad
Published in Langenbeck's archives of surgery (16.12.2023)
Published in Langenbeck's archives of surgery (16.12.2023)
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Journal Article
The robotic learning curve for a newly appointed colorectal surgeon
Saqib, Sabah Uddin, Raza, Muhammad Zeeshan, Evans, Charles, Bajwa, Adeel Ahmad
Published in Journal of robotic surgery (01.02.2023)
Published in Journal of robotic surgery (01.02.2023)
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Journal Article
Reliability challenges in advance packaging
Iyer, Subramanian S., Bajwa, Adeel Ahmad
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
ECTC/ITherm Joint Diversity Panel
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
(01.06.2021)
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Conference Proceeding
A Case for Packageless Processors
Pal, Saptadeep, Petrisko, Daniel, Bajwa, Adeel A., Gupta, Puneet, Iyer, Subramanian S., Kumar, Rakesh
Published in 2018 IEEE International Symposium on High Performance Computer Architecture (HPCA) (01.02.2018)
Published in 2018 IEEE International Symposium on High Performance Computer Architecture (HPCA) (01.02.2018)
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Conference Proceeding