by Chen, Xinyu, Xie, Yufeng, Sheng, Yaochen, Tang, Hongwei, Wang, Zeming, Wang, Yu, Wang, Yin, Liao, Fuyou, Ma, Jingyi, Guo, Xiaojiao, Tong, Ling, Liu, Hanqi, Liu, Hao, Wu, Tianxiang, Cao, Jiaxin, Bu, Sitong, Shen, Hui, Bai, Fuyu, Huang, Daming, Deng, Jianan, Riaud, Antoine, Xu, Zihan, Wu, Chenjian, Xing, Shiwei, Lu, Ye, Ma, Shunli, Sun, Zhengzong, Xue, Zhongyin, Di, Zengfeng, Gong, Xiao, Zhang, David Wei, Zhou, Peng, Wan, Jing, Bao, Wenzhong
Published in Nature communications (12.10.2021)

by Bai, Fuyu, Dong, Fei, Sui, Yan, Xue, Jianyang, Wu, Chenwei, Song, Dejun, Hu, Chengming
Published in Construction & building materials (29.08.2023)

by Wu, Chenwei, Xue, Jianyang, Zhang, Xicheng, Bai, Fuyu, Ma, Hedi
Published in International journal of architectural heritage (03.04.2023)

by Liu, Kang, Xue, Jianyang, Bai, Fuyu, Ma, Linlin, Song, Dejun, Xue, Hao
Published in The structural design of tall and special buildings (12.10.2024)

by Bai, Fuyu, Fan, Zekai, Xue, Jianyang, Wu, Chenwei, Hu, Chengming, Li, Jiaxu
Published in Structures (Oxford) (01.08.2023)

by Sheng, Yaochen, Chen, Xinyu, Liao, Fuyou, Wang, Yin, Ma, Jingyi, Deng, Jianan, Guo, Zhongxun, Bu, Sitong, Shen, Hui, Bai, Fuyu, Huang, Daming, Wang, Jianlu, Hu, Weida, Chen, Lin, Zhu, Hao, Sun, Qingqing, Zhou, Peng, Zhang, David Wei, Wan, Jing, Bao, Wenzhong
Published in Advanced electronic materials (01.07.2021)

by Sheng, Yaochen, Chen, Xinyu, Liao, Fuyou, Wang, Yin, Ma, Jingyi, Deng, Jianan, Guo, Zhongxun, Bu, Sitong, Shen, Hui, Bai, Fuyu, Huang, Daming, Wang, Jianlu, Hu, Weida, Chen, Lin, Zhu, Hao, Sun, Qingqing, Zhou, Peng, Zhang, David Wei, Wan, Jing, Bao, Wenzhong
Published in Advanced electronic materials (01.07.2021)

by Bai, Fuyu, Shen, Hui, Huang, Daming
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)

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