Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects
Jung, Sung-Yup, Kim, Byoung-Joon, Lee, Nam Yeal, Kim, Baek-Mann, Yeom, Seung Jin, Kwak, Noh Jung, Joo, Young-Chang
Published in Microelectronic engineering (2012)
Published in Microelectronic engineering (2012)
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Conference Proceeding
Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
Moon, Dae-Yong, Han, Dong-Suk, Park, Jae-Hyung, Shin, Sae-Young, Park, Jong-Wan, Kim, Baek Mann, Cho, Jun Yeol
Published in Thin solid films (30.10.2012)
Published in Thin solid films (30.10.2012)
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Journal Article
Conference Proceeding
Effects of the substrate temperature on the Cu seed layer formed using atomic layer deposition
Moon, Dae-Yong, Han, Dong-Suk, Shin, Sae-Yong, Park, Jong-Wan, Kim, Baek Mann, Kim, Jae Hong
Published in Thin solid films (31.03.2011)
Published in Thin solid films (31.03.2011)
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Journal Article
The characteristics of Cu-drift induced dielectric breakdown under alternating polarity bias temperature stress
Sung-Yup Jung, Byoung-Joon Kim, Nam Yeal Lee, Baek-Mann Kim, Seung Jin Yeom, Noh Jung Kwak, Young-Chang Joo
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
Effect of hydrogen atmosphere in Cu thin film growth by chemical vapor deposition using Cu(dmamb) 2
Choi, Jong Mun, Lee, Dohan, Park, Ji Hun, Kim, Chang Gyoun, Chung, Taek-Mo, Kim, Baek-Mann, Byun, Dongjin
Published in Microelectronic engineering (2012)
Published in Microelectronic engineering (2012)
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Journal Article
Conference Proceeding
Copper seed layer using atomic layer deposition for Cu interconnect
Dae-Yong Moon, Tae-Suk Kwon, Byung-Woo Kang, Woong-Sun Kim, Baek Mann Kim, Jae Hong Kim, Jong-Wan Park
Published in 2010 3rd International Nanoelectronics Conference (INEC) (01.01.2010)
Published in 2010 3rd International Nanoelectronics Conference (INEC) (01.01.2010)
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Conference Proceeding
Effects of B2H6 Pretreatment on ALD of W Film Using a Sequential Supply of WF6 and SiH4
Kim, Soo-Hyun, Hwang, Eui-Seong, Kim, Baek-Mann, Lee, Joo-Wan, Sun, Ho-Jung, Hong, Tae Eun, Kim, Jun-Ki, Sohn, Hyunchul, Kim, Jinwoong, Yoon, Tae-Sik
Published in Electrochemical and solid-state letters (01.01.2005)
Published in Electrochemical and solid-state letters (01.01.2005)
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Journal Article
Effects of B[sub 2]H[sub 6] Pretreatment on ALD of W Film Using a Sequential Supply of WF[sub 6] and SiH[sub 4]
Kim, Soo-Hyun, Hwang, Eui-Seong, Kim, Baek-Mann, Lee, Joo-Wan, Sun, Ho-Jung, Hong, Tae Eun, Kim, Jun-Ki, Sohn, Hyunchul, Kim, Jinwoong, Yoon, Tae-Sik
Published in Electrochemical and solid-state letters (2005)
Published in Electrochemical and solid-state letters (2005)
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