Thermal Characteristics of Chip Stack and Package Stack Memory Devices in the Component and Module Level
Heejin Lee, Haehyung Lee, Jaebeom Byun, Jin-yang Lee, Joonghyun Baek, Younghee Song
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
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Conference Proceeding
Semiconductor package
KANG HYUNGU, IM EUNJEONG, YOON SUNGHWAN, BAEK JOONGHYUN, LEE CHEOL WOO
Year of Publication 01.08.2024
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Year of Publication 01.08.2024
Patent
Thermal management of high power memory module
Heejin Lee, Haehyung Lee, Joonghyun Baek, Taegyeong Chung, Seyong Oh
Published in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium (2006)
Published in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium (2006)
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Conference Proceeding
Micro cooling application on high density memory module
Yunhyeok Im, Hyejung Cho, Minha Kim, Joonghyun Baek
Published in Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003 (2003)
Published in Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003 (2003)
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Conference Proceeding
Optimization of TAB inner lead bonding process
Jung, Ilgyu, Lee, Taekoo, Baek, Joonghyun, Kim, Hyungho
Published in Annual IEEE Semiconductor Thermal Measurement and Management Symposium (1996)
Published in Annual IEEE Semiconductor Thermal Measurement and Management Symposium (1996)
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Conference Proceeding
Journal Article
Package embedded heat exchanger for stacked multi-chip module
Lee, Haehyung, Jeong, Yongwon, Shin, Joonghan, Baek, Joonghyun, Kang, Moonkoo, Chun, Kukjin
Published in Sensors and actuators. A. Physical. (01.09.2004)
Published in Sensors and actuators. A. Physical. (01.09.2004)
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Journal Article
SEMICONDUCTOR PACKAGE
LEE, Cheol-Woo, BAEK, Joonghyun, KANG, Hyungu, IM, Eunjeong, YOON, Sunghwan
Year of Publication 25.07.2024
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Year of Publication 25.07.2024
Patent
STACK SEMICONDUCTOR PACKAGE
Kim, Taeyoung, Lee, Cheolwoo, CHUNG, Hyunsoo, Kang, Hyungu, Sung, Jaekyu, Baek, Joonghyun
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
Patent
Thermal characterization of high performance MCP with silicon spacer having low thermal impedance
Haehyung Lee, Sangwook Park, Joonghyun Baek, Jinyang Lee, Dongho Lee, Seyong Oh
Published in Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005 (2005)
Published in Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005 (2005)
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Conference Proceeding
Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages
Chung, T., Kim, M., Baek, J., Oh, S.
Published in Annual IEEE Semiconductor Thermal Measurement and Management Symposium (1999)
Published in Annual IEEE Semiconductor Thermal Measurement and Management Symposium (1999)
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Conference Proceeding
Journal Article