Thymic stromal lymphopoietin downregulates filaggrin expression by signal transducer and activator of transcription 3 (STAT3) and extracellular signal-regulated kinase (ERK) phosphorylation in keratinocytes
Kim, Jin Hee, PhD, Bae, Hyun Cheol, PhD, Ko, Na Young, MD, PhD, Lee, See Hyun, MD, Jeong, Sang Hoon, PhD, Lee, Hana, MSc, Ryu, Woo-In, BSc, Kye, Young Chul, MD, PhD, Son, Sang Wook, MD, PhD
Published in Journal of allergy and clinical immunology (01.07.2015)
Published in Journal of allergy and clinical immunology (01.07.2015)
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Collective laser‐assisted bonding process for 3D TSV integration with NCP
Alves Braganca, Wagno, Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Seok Hwan, Bae, Hyun‐Cheol, Choi, Kwang‐Seong
Published in ETRI journal (01.06.2019)
Published in ETRI journal (01.06.2019)
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Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom, Yong‐Sung, Jang, Keon‐Soo, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong
Published in ETRI journal (01.12.2019)
Published in ETRI journal (01.12.2019)
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Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
Jung, Daniel H., Youngwoo Kim, Kim, Jonghoon J., Heegon Kim, Sumin Choi, Yoon-Ho Song, Hyun-Cheol Bae, Kwang-Seong Choi, Piersanti, Stefano, de Paulis, Francesco, Orlandi, Antonio, Joungho Kim
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)
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Hypoxic condition enhances chondrogenesis in synovium-derived mesenchymal stem cells
Bae, Hyun Cheol, Park, Hee Jung, Wang, Sun Young, Yang, Ha Ru, Lee, Myung Chul, Han, Hyuk-Soo
Published in Biomaterials research (26.09.2018)
Published in Biomaterials research (26.09.2018)
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High-glutathione mesenchymal stem cells isolated using the FreSHtracer probe enhance cartilage regeneration in a rabbit chondral defect model
Cho, Gun Hee, Bae, Hyun Cheol, Cho, Won Young, Jeong, Eui Man, Park, Hee Jung, Yang, Ha Ru, Wang, Sun Young, Kim, You Jung, Shin, Dong Myung, Chung, Hyung Min, Kim, In Gyu, Han, Hyuk-Soo
Published in Biomaterials research (31.05.2023)
Published in Biomaterials research (31.05.2023)
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Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding
Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung, Bae, Hyun‐Cheol, Lee, Jin Ho
Published in ETRI journal (01.12.2016)
Published in ETRI journal (01.12.2016)
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Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae, Hyun‐Cheol, Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung
Published in ETRI journal (01.12.2013)
Published in ETRI journal (01.12.2013)
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Measurement and Analysis of a High-Speed TSV Channel
KIM, Heegon, CHO, Jonghyun, KIM, Jiseong, KIM, Myunghoi, KIM, Kiyeong, LEE, Junho, LEE, Hyungdong, PARK, Kunwoo, CHOI, Kwangseong, BAE, Hyun-Cheol, KIM, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)
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Interconnection Technology Based on InSn Solder for Flexible Display Applications
Choi, Kwang‐Seong, Lee, Haksun, Bae, Hyun‐Cheol, Eom, Yong‐Sung, Lee, Jin Ho
Published in ETRI journal (01.04.2015)
Published in ETRI journal (01.04.2015)
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Journal Article
Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life
Eom, Yong‐Sung, Son, Ji‐Hye, Jang, Keon‐Soo, Lee, Hak‐Sun, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Choi, Heung‐Soap
Published in ETRI journal (01.06.2014)
Published in ETRI journal (01.06.2014)
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Novel Bumping Process for Solder on Pad Technology
Choi, Kwang‐Seong, Bae, Ho‐Eun, Bae, Hyun‐Cheol, Eom, Yong‐Sung
Published in ETRI journal (01.04.2013)
Published in ETRI journal (01.04.2013)
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Journal Article
Novel Bumping and Underfill Technologies for 3D IC Integration
Sung, Ki‐Jun, Choi, Kwang‐Seong, Bae, Hyun‐Cheol, Kwon, Yong‐Hwan, Eom, Yong‐Sung
Published in ETRI journal (01.10.2012)
Published in ETRI journal (01.10.2012)
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Journal Article
Novel Bumping Material for Solder‐on‐Pad Technology
Choi, Kwang‐Seong, Chu, Sun‐Woo, Lee, Jong‐Jin, Sung, Ki‐Jun, Bae, Hyun‐Cheol, Lim, Byeong‐Ok, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.08.2011)
Published in ETRI journal (01.08.2011)
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Journal Article
Novel Maskless Bumping for 3D Integration
Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.04.2010)
Published in ETRI journal (01.04.2010)
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