Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
Fan, Yaohui, Wu, Yifan, Dale, Travis F., Lakshminarayana, Sukshitha Achar Puttur, Greene, Colin V., Badwe, Nilesh U., Aspandiar, Raiyo F., Blendell, John E., Subbarayan, Ganesh, Handwerker, Carol A.
Published in Journal of electronic materials (01.12.2021)
Published in Journal of electronic materials (01.12.2021)
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