Can UTeach? Assessing the relative effectiveness of STEM teachers
Backes, Ben, Goldhaber, Dan, Cade, Whitney, Sullivan, Kate, Dodson, Melissa
Published in Economics of education review (01.06.2018)
Published in Economics of education review (01.06.2018)
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Journal Article
The common core conundrum: To what extent should we worry that changes to assessments will affect test-based measures of teacher performance?
Backes, Ben, Cowan, James, Goldhaber, Dan, Koedel, Cory, Miller, Luke C., Xu, Zeyu
Published in Economics of education review (01.02.2018)
Published in Economics of education review (01.02.2018)
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Journal Article
Is it worth it? Postsecondary education and labor market outcomes for the disadvantaged
Backes, Ben, Holzer, Harry J, Dunlop Velez, Erin
Published in IZA journal of labor policy (01.01.2015)
Published in IZA journal of labor policy (01.01.2015)
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Journal Article
Post Cu CMP Cleaning of Polyurethane Pad Debris
Tseng, Wei-Tsu, Rill, Elliott, Backes, Benjamin, Chace, Mark, Yao, Yiping, DeHaven, Patrick, Ticknor, Adam, Devarapalli, Vamsi, Khojasteh, Mahmoud, Steber, David, Economikos, Laertis, Truong, Connie, Majors, Christopher
Published in ECS journal of solid state science and technology (01.01.2014)
Published in ECS journal of solid state science and technology (01.01.2014)
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Journal Article
Thermal and spatial profiling of TSV-induced stress in 3DICs
McDonough, Colin, Backes, Benjamin, Wei Wang, Geer, Robert E
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
Examining Spillover Effects from Teach for America Corps Members in Miami-Dade County Public Schools. Working Paper 113
Hansen, Michael, Backes, Benjamin, Brady, Victoria, Xu, Zeyu
Published in National Center for Analysis of Longitudinal Data in Education Research (CALDER) (01.08.2015)
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Published in National Center for Analysis of Longitudinal Data in Education Research (CALDER) (01.08.2015)
Report
Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
Sukumaran, Vijay, Thuy Tran-Quinn, Lubguban, Jorge, Webster, Dave, Hedrick, Brittany, Cox, Harry, Wood, James, Miyazoe, Hiroyuki, Yan, Hongwen, Joseph, Eric, Zhang, Hongqing, Backes, Benjamin, Chace, Mark, Perfecto, Eric, Melville, Ian, Angyal, Matthew
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding