by Pogodin, A. I., Studenyak, I. P., Shender, I. A., Pop, M. M., Filep, M. J., Malakhovska, T. O., Kokhan, O. P., Kopčanský, P., Babuka, T. Y.
Published in Journal of materials science (01.03.2022)

by Pogodin, A. I., Pop, M. M., Shender, I. A., Studenyak, I. P., Filep, M. J., Malakhovska, T. O., Kokhan, O. P., Babuka, T. Y., Suslikov, L. M., Rubish, V. M.
Published in Journal of materials science. Materials in electronics (01.06.2022)

by Pogodin, A. I., Pop, M. M., Shender, I. O., Studenyak, I. P., Filep, M. J., Malakhovska, T. O., Kokhan, O. P., Babuka, T. Y., Stercho, I. P., Rubish, V. M., Kopčanský, P.
Published in Journal of materials science. Materials in electronics (01.09.2022)

by Studenyak, I.P., Pogodin, A.I., Filep, M.J., Symkanych, O.I., Babuka, T.Y., Kokhan, O.P., Kúš, P.
Published in Journal of alloys and compounds (25.08.2021)