by Brunschwiler, T., Michel, B., Rothuizen, H., Kloter, U., Wunderle, B., Oppermann, H., Reichl, H.
Published in Microsystem technologies : sensors, actuators, systems integration (2009)

by Wälchli, R., Brunschwiler, T., Michel, B., Poulikakos, D.
Published in Fungal ecology (01.02.2010)

by Bezerra, Pedro A. M., Krismer, Florian, Kolar, Johann W., Aljameh, Riduan K., Paredes, S., Heller, R., Brunschwiler, T., Francese, Pier A., Morf, T., Kossel, Marcel A., Braendli, M.
Published in IEEE open journal of power electronics (2020)

by MORF, T, WEISS, J, KULL, L, ROTHUIZEN, H, TOIFL, T, KOSSEL, M, MENOLFI, C, VON BUEREN, G, BRUNSCHWILER, T, SCHMATZ, M
Published in Electronics letters (2009)

by Brunschwiler, T, Paredes, S, Drechsler, U, Michel, B, Wunderle, B, Reichl, H
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)

by Linderman, R. J., Brunschwiler, T., Kloter, U., Toy, H., Michel, B.
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)

by Offrein, B.J., Jubin, D., Koster, T., Brunschwiler, T., Horst, F., Wiesmann, D., Meijer, I., Petit, M.S., Webb, D., Germann, R., Bona, G.L.
Published in IEEE photonics technology letters (01.06.2004)

by Brunschwiler, T., Kloter, U., Linderman, R.J., Rothuizen, H., Michel, B.
Published in IEEE transactions on components and packaging technologies (01.06.2007)

by Brunschwiler, T., Smith, B., Ruetsche, E., Michel, B.
Published in IBM journal of research and development (01.01.2009)

by Brunschwiler, T., Kloter, U., Linderman, R., Rothuizen, H., Michel, B.
Published in Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005 (2005)

by Sridhar, A, Vincenzi, A, Ruggiero, M, Brunschwiler, T, Atienza, D
Published in 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2010)

by Stiebing, M., Lortscher, E., Steller, W., Vogel, D., Wolf, M. J., Brunschwiler, T., Wunderle, B.
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)

by Brunschwiler, T, Paredes, S, Drechsler, U, Michel, B, Cesar, W, Leblebici, Y, Wunderle, B, Reichl, H
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)

by Sabry, M. M., Coskun, A. K., Atienza, D., Rosing, T. S., Brunschwiler, T.
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.2011)

by Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)

by Morf, T, Weiss, J, Kull, L, Rothuizen, H, Toifl, T, Kossel, M, Menolfi, C, von Bueren, G, Brunschwiler, T, Schmatz, M
Published in Electronics letters (03.12.2009)

by Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Wunderle, B., Reichl, H.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)

by Tiwari, Manish K., Zimmermann, S., Sharma, C. S., Alfieri, F., Renfer, A., Brunschwiler, T., Meijer, I., Michel, B., Poulikakos, D.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)

by Goicochea, J. V., Brunschwiler, T., Zurcher, J., Wolf, H., Matsumoto, K., Michel, B.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)

by Smith, B., Brunschwiler, T., Michel, B.
Published in Microelectronics (01.09.2009)