Search Results - "BOYAPATI SRI RANGA" :: K.UTB vyhledávací portál

MICROELECTRONIC SUBSTRATES HAVING COPPER ALLOY CONDUCTIVE ROUTE STRUCTURES

by MAY ROBERT ALAN, BOYAPATI SRI RANGA SAI SAI, ALUR AMRUTHAVALLI PALLAVI, SOBIESKI DANIEL
Year of Publication 20.07.2016

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DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE

by BOYAPATI, Sri Ranga Sai Sai, MAY, Robert Alan, DARMAWIKARTA, Kristof
Year of Publication 28.03.2024

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Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate

by May, Robert Alan, Darmawikarta, Kristof, Boyapati, Sri Ranga Sai Sai
Year of Publication 13.02.2024

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ORGANIC PACKAGE CORE FOR A SUBSTRATE WITH HIGH DENSITY PLATED HOLES

by SWAMINATHAN, RAJA, BOYAPATI, SRI RANGA SAI, KULKARNI, DEEPAK VASANT
Year of Publication 08.02.2024

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Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate

by May, Robert Alan, Darmawikarta, Kristof, Boyapati, Sri Ranga Sai Sai
Year of Publication 10.10.2023

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Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate

by BOYAPATI, Sri Ranga Sai Sai, MAY, Robert Alan, DARMAWIKARTA, Kristof
Year of Publication 11.05.2023

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THROUGH-MAGNETIC INDUCTOR

by Spurney, Robert Grant, Pfeiffenberger, Alexander Helmut, Kulkarni, Deepak Vasant, Boyapati, Sri Ranga Sai
Year of Publication 27.06.2024

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PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES

by BOYAPATI, Sri Ranga Sai, TANAKA, Hiroki, MAY, Robert Alan, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Year of Publication 14.03.2024

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Multi-chip package with high density interconnects

by Aleksov, Aleksandar, Darmawikarta, Kristof, May, Robert A, Elsherbini, Adel A, Boyapati, Sri Ranga Sai
Year of Publication 20.02.2024

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Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging

by Tanaka, Hiroki, Darmawikarta, Kristof, May, Robert A, Boyapati, Sri Ranga Sai
Year of Publication 20.02.2024

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METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY

by Kulkarni, Deepak Vasant, Alam, Arsalan, Wilkerson, Brett P, Boyapati, Sri Ranga Sai, Swaminathan, Raja
Year of Publication 08.02.2024

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METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY

by BOYAPATI, Sri Ranga Sai, ALAM, Arsalan, WILKERSON, Brett P, KULKARNI, Deepak Vasant, SWAMINATHAN, Raja
Year of Publication 08.02.2024

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Patch accommodating embedded dies having different thicknesses

by Pietambaram, Srinivas, May, Robert Alan, Tanaka, Hiroki, Darmawikarta, Kristof, Boyapati, Sri Ranga Sai, Manepalli, Rahul N
Year of Publication 02.01.2024

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PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS

by May, Robert Alan, Tanaka, Hiroki, Darmawikarta, Kristof Kuwawi, Pietambaram, Srinivas V, Boyapati, Sri Ranga Sai
Year of Publication 28.12.2023

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Substrate with variable height conductive and dielectric elements

by Aleksov, Aleksandar, Darmawikarta, Kristof, Liu, Changhua, Nie, Bai, Chen, Haobo, Boyapati, Sri Ranga Sai
Year of Publication 05.12.2023

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Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

by Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Sankman, Robert L, Boyapati, Sri Ranga Sai
Year of Publication 19.09.2023

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Microelectronic device with embedded die substrate on interposer

by Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Li, Sheng, Darmawikarta, Kristof, Sankman, Robert L, Boyapati, Sri Ranga Sai
Year of Publication 23.07.2024

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