PACKAGE SUBSTRATES WITH INTEGRAL DEVICES
BOYAPATI, Sri Ranga Sai, MAY, Robert Alan, DARMAWIKARTA, Kristof Kuwawi
Year of Publication 30.11.2017
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Year of Publication 30.11.2017
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ENABLING MAGNETIC FILMS IN INDUCTORS INTEGRATED INTO SEMICONDUCTOR PACKAGES
DARMAWIKARTA, Kirstof, BOYAPATI, Sri Ranga Sai, CHATTERJEE, Prithwish, PIETAMBARAM, Srinivas, JEN, Wei Lun
Year of Publication 26.09.2019
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Year of Publication 26.09.2019
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Multi-die microelectronic device with integral heat spreader
Aleksov, Aleksandar, May, Robert Alan, Darmawikarta, Kristof, Pietambaram, Srinivas V, Boyapati, Sri Ranga Sai, Manepalli, Rahul N
Year of Publication 11.08.2020
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Year of Publication 11.08.2020
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FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PATCH ARCHITECTURE
BOYAPATI, Sri Ranga Sai, PRATAP, Divya, DESHPANDE, Nitin, KARHADE, Omkar, VADLAMANI, Sai, ECTON, Jeremy, TANAKA, Hiroki, LI, Xiaoqian, MAY, Robert Alan, PIETAMBARAM, Srinivas V, MARIN, Brandon C
Year of Publication 16.06.2022
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Year of Publication 16.06.2022
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Substrate integrated waveguide
Moussallem, Maroun, Pietambaram, Srinivas, May, Robert Alan, Jain, Rahul, Darmawikarta, Kristof, Boyapati, Sri Ranga Sai, Manepalli, Rahul N
Year of Publication 07.07.2020
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Year of Publication 07.07.2020
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Inorganic interposer for multi-chip packaging
Sobieski, Daniel, Lee, Kyu Oh, Qian, Zhiguo, Darmawikarta, Kristof, Celikkol, Merve, Aygun, Kemal, Boyapati, Sri Ranga Sai
Year of Publication 23.06.2020
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Year of Publication 23.06.2020
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PATCH ACCOMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
BOYAPATI, Sri Ranga Sai, TANAKA, Hiroki, MAY, Robert Alan, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Year of Publication 04.07.2019
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Year of Publication 04.07.2019
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SUBSTRATE WITH VARIABLE HEIGHT CONDUCTIVE AND DIELECTRIC ELEMENTS
CHEN, Haobo, BOYAPATI, Sri Ranga Sai, NIE, Bai, DARMAWIKARTA, Kristof, ALEKSOV, Aleksandar, LIU, Changhua
Year of Publication 04.07.2019
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Year of Publication 04.07.2019
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MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
Aleksov, Aleksandar, Darmawikarta, Kristof, May, Robert A, Elsherbini, Adel A, Boyapati, Sri Ranga Sai
Year of Publication 27.06.2019
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Year of Publication 27.06.2019
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POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKAGING
Aleksov, Aleksandar, Tanaka, Hiroki, May, Robert A, Darmawikarta, Kristof, Boyapati, Sri Ranga Sai
Year of Publication 27.06.2019
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Year of Publication 27.06.2019
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PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR REDUCED BUMP PITCH
BOYAPATI, Sri Ranga Sai, AKKINEPALLY, Praneeth, TANAKA, Hiroki, TRUONG, Frank, LINK, Lauren A, May, Robert A, CHATTERJEE, Prithwish, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas V, BROWN, Andrew J
Year of Publication 06.05.2021
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Year of Publication 06.05.2021
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REDUNDANT THROUGH-HOLE INTERCONNECT STRUCTURES
BOYAPATI, Sri, Ranga Sai, MOUSSALLEM, Maroun, D, SCHUCKMAN, Amanda, E
Year of Publication 29.06.2017
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Year of Publication 29.06.2017
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