FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PATCH ARCHITECTURE
BOYAPATI, Sri Ranga Sai, DESHPANDE, Nitin, KARHADE, Omkar, ECTON, Jeremy, PRATAP, Divya, VADLAMANI, Sai, TANAKA, Hiroki, LI, Xiaoqian, MARIN, Brandon, PIETAMBARAM, Srinivas V, MAY, Robert
Year of Publication 22.06.2022
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Year of Publication 22.06.2022
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PATCH ACCOMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
BOYAPATI, Sri Ranga Sai, TANAKA, Hiroki, MAY, Robert Alan, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Year of Publication 20.08.2020
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Year of Publication 20.08.2020
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PATCH ACCOMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
BOYAPATI, Sri Ranga Sai, TANAKA, Hiroki, MAY, Robert Alan, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Year of Publication 29.07.2020
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Year of Publication 29.07.2020
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Multi-chip package with high density interconnects
Aleksov, Aleksandar, Darmawikarta, Kristof, May, Robert A, Elsherbini, Adel A, Boyapati, Sri Ranga Sai
Year of Publication 28.07.2020
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Year of Publication 28.07.2020
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Electromigration resistant and profile consistent contact arrays
Lehaf, Ali, Pietambaram, Srinivas, Cho, Steve, May, Robert Alan, Tanaka, Hiroki, Darmawikarta, Kristof, Han, Jung Kyu, Heaton, Thomas, Boyapati, Sri Ranga Sai
Year of Publication 19.04.2022
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Year of Publication 19.04.2022
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MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
SALAMA, Islam A, BOYAPATI, Sri Ranga Sai, SANKMAN, Robert L, ALUR, Amruthavalli Pallavi, MAY, Robert Alan, LI, Sheng, DARMAWIKARTA, Kristof
Year of Publication 07.04.2022
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Year of Publication 07.04.2022
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DIELECTRIC FOR HIGH DENSITY SUBSTRATE INTERCONNECTS
BOYAPATI, Sri Ranga Sai, MAY, Robert A, BROWN, Andrew J, DARMAWIKARTA, Kristof
Year of Publication 16.04.2020
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Year of Publication 16.04.2020
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SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHITECTURES
BOYAPATI, Sri Ranga Sai, HAN, Jung Kyu, DARMAWAIKARTA, Kristof, SENEVIRATNE, Dilan, ELURI, Ravindranadh, HEATON, Thomas, TANAKA, Hiroki, PIETAMBARAM, Srinivas, ALEKSOV, Aleksandar, KANDANUR, Sashi, MAY, Robert, CHO, Steve, LEHAF, Ali
Year of Publication 19.01.2023
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Year of Publication 19.01.2023
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Surface finishes with low rBTV for fine and mixed bump pitch architectures
Kandanur, Sashi, Aleksov, Aleksandar, Eluri, Ravindranadh, Tanaka, Hiroki, May, Robert, Darmawaikarta, Kristof, Boyapati, Sri Ranga Sai, Lehaf, Ali, Pietambaram, Srinivas, Cho, Steve, Han, Jung Kyu, Heaton, Thomas, Seneviratne, Dilan
Year of Publication 01.11.2022
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Year of Publication 01.11.2022
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Method of fabricating a microelectronic substrate
May, Robert A, Sobieski, Daniel N, Alur, Amruthavalli P, Boyapati, Sri Ranga Sai
Year of Publication 03.12.2019
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Year of Publication 03.12.2019
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