MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
BOYAPATI, Sri Ranga Sai, MAY, Robert A, DARMAWIKARTA, Kristof, ALEKSOV, Aleksandar, ELSHERBINI, Adel A
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
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INTEGRATED CIRCUIT PACKAGE SUPPORTS
Aleksov, Aleksandar, Darmawikarta, Kristof Kuwawi, May, Robert, Pietambaram, Srinivas V, Tan, Chung Kwang Christopher, Boyapati, Sri Ranga Sai
Year of Publication 29.02.2024
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Year of Publication 29.02.2024
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Microelectronic device with embedded die substrate on interposer
Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Li, Sheng, Darmawikarta, Kristof, Sankman, Robert L, Boyapati, Sri Ranga Sai
Year of Publication 06.02.2024
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Year of Publication 06.02.2024
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Integrated circuit package supports
Aleksov, Aleksandar, Darmawikarta, Kristof Kuwawi, May, Robert, Pietambaram, Srinivas V, Tan, Chung Kwang Christopher, Boyapati, Sri Ranga Sai
Year of Publication 26.12.2023
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Year of Publication 26.12.2023
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PATCH ACCOMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
BOYAPATI, Sri Ranga Sai, TANAKA, Hiroki, MAY, Robert Alan, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas, MANEPALLI, Rahul N
Year of Publication 02.02.2023
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Year of Publication 02.02.2023
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Dielectric for high density substrate interconnects
May, Robert A, Darmawikarta, Kristof, Brown, Andrew J, Boyapati, Sri Ranga Sai
Year of Publication 10.01.2023
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Year of Publication 10.01.2023
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MAGNETO-OPTICAL KERR EFFECT INTERCONNECTS FOR PHOTONIC PACKAGING
Tanaka, Hiroki, Darmawikarta, Kristof, May, Robert, Marin, Brandon, Boyapati, Sri Ranga Sai
Year of Publication 29.12.2022
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Year of Publication 29.12.2022
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MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
SALAMA, Islam A, BOYAPATI, Sri Ranga Sai, SANKMAN, Robert L, ALUR, Amruthavalli Pallavi, MAY, Robert Alan, LI, Sheng, DARMAWIKARTA, Kristof
Year of Publication 03.10.2024
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Year of Publication 03.10.2024
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MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
Aleksov, Aleksandar, Darmawikarta, Kristof, May, Robert A, Elsherbini, Adel A, Boyapati, Sri Ranga Sai
Year of Publication 06.10.2022
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Year of Publication 06.10.2022
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CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
STRAAYER, Matthew, BOYAPATI, Sri Ranga Sai, HARITSA, Manjunath D, DHAVALESWARAPU, Hemanth Kumar, KULKARNI, Deepak Vasant, NAFFZIGER, Samuel, PFEIFFENBERGER, Alexander Helmut, BURKHART, Justin Michael, SWAMINATHAN, Raja
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
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CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
STRAAYER, Matthew, BOYAPATI, Sri Ranga Sai, HARITSA, Manjunath D, DHAVALESWARAPU, Hemanth Kumar, KULKARNI, Deepak Vasant, NAFFZIGER, Samuel, PFEIFFENBERGER, Alexander Helmut, BURKHART, Justin Michael, SWAMINATHAN, Raja
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
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Multi-chip package with high density interconnects
Aleksov, Aleksandar, Darmawikarta, Kristof, May, Robert A, Elsherbini, Adel A, Boyapati, Sri Ranga Sai
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
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