Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
Braun, Tanja, Le, Thi Huyen, Rossi, Marco, Ndip, Ivan, Holck, Ole, Becker, Karl-Friedrich, Bottcher, Mathias, Schiffer, Michael, Aschenbrenner, Rolf, Muller, Friedrich, Voitel, Marcus, Schneider-Ramelow, Martin, Wieland, Marcel, Goetze, Christian, Trewhella, Jean, Berger, Daniel
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating
Killge, Sebastian, Bartusseck, Irene, Junige, Marcel, Neumann, Volker, Reif, Johanna, Wenzel, Christian, Böttcher, Mathias, Albert, Matthias, Jürgen Wolf, M., Bartha, Johann W.
Published in Microelectronic engineering (15.01.2019)
Published in Microelectronic engineering (15.01.2019)
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Journal Article
3D integration of standard integrated circuits
Puschmann, Rene, Bottcher, Mathias, Bartusseck, Irene, Windrich, Frank, Fiedler, Conny, John, Peggy, Manier, Charles, Zoschke, Kai, Grafe, Jurgen, Oppermann, Hermann, Wolf, M. Jurgen, Lang, K. Dieter, Ziesmann, Michael
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Ultra-thin high density capacitors for advanced packaging solutions
Seidel, Konrad, Bottcher, Mathias, Dobritz, Stefan, Czernohorsky, Malte, Riedel, Stefan, Weinreich, Wenke
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding
Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Xiaomin Duan, Bottcher, Mathias, Dobritz, Stephan, Dahl, David, Schuster, Christian, Ndip, Ivan, Lang, Klaus-Dieter
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding
Soft error resistant semiconductor device
Schammler, Gisela, Bottcher, Mathias, Kuechenmeister, Frank, Gehre, Daniel, Zschech, Ehrenfried
Year of Publication 26.08.2004
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Year of Publication 26.08.2004
Patent
Soft error resistant semiconductor device
BOTTCHER MATHIAS, SCHAMMLER GISELA, GEHRE DANIEL, ZSCHECH EHRENFRIED, KUECHENMEISTER FRANK
Year of Publication 26.08.2004
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Year of Publication 26.08.2004
Patent
Convergence and interaction of BEOL and BE reliability methodology
Rzepka, S., Lepper, M., Bottcher, M., Bauer, R., Weber, S.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding