by Sun, Jianxun, Li, Yuan Bo, Ye, Yiyang, Zhang, Jun, Chong, Gang Yih, Tan, Juan Boon, Liu, Zhen, Chen, Tupei
Published in IEEE access (2020)

by Sun, Jianxun, Tan, Juan Boon, Chen, Tupei
Published in IEEE transactions on electron devices (01.10.2020)

by Ong, Xuefen, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong
Published in Microelectronics and reliability (01.02.2009)

by Sun, Jianxun, Tan, Juan Boon, Chen, Tupei
Published in IEEE transactions on electron devices (01.10.2020)

by Sun, Jianxun, Tan, Juan Boon, Chen, Tupei
Published in IEEE transactions on electron devices (01.10.2020)

by Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun
Published in Microelectronics and reliability (01.07.2010)

by Yue Ying Ong, Soon Wee Ho, Sekhar, V N, Xuefen Ong, Ong, J, Xiaowu Zhang, Vaidyanathan, K, Seung Uk Yoon, Lau, J H, Lim Yeow Kheng, Yeo, D, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)

by Hua Younan, Lim Yeow Kheng, Zhao Siping, Ramesh, R., Tan Juan Boon
Published in 2006 IEEE International Conference on Semiconductor Electronics (01.11.2006)

by Oswald, Jens, Goetze, Christian, Shan Gao, ShunQiang Gong, Juan Boon Tan, Reed, Rick, YoungRae Kim
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)

by Mirza, Fahad, Khor, E. E. Jan, Fook Hong Lee, Premachandran, C. S., Wanbing Yi, Juan Boon Tan, Graas, Carole, Justison, Patrick
Published in 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2016)

by Bhushan, Bharat, Yi Jiang, Wanbing Yi, Juan Boon Tan, Zhehui Wang, Chin Chuan Neo, Guoqing Lin, Kah Wee, Ju Dy, Yew Tuck Chow, Poh, Francis, Shum, Danny, Nagel, Kerry, Deshpande, Sarin, Hossain, Moazzem, Aggarwal, Sanjeev
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)

by Yew, Kwang Sing, Ong, Ran Xing, Yap, Hin Kiong, Yi, Wanbing, Phang, Jacquelyn, Chockalingam, R., Tan, Juan Boon
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)

by Wanbing Yi, Daxiang Wang, Kemao Lin, Shaoqiang Zhang, Juan Boon Tan
Published in IEEE International Interconnect Technology Conference (01.05.2014)

by Verma, P. R., Zhang Shaoqiang, Chew Kok Wai, Tan Juan Boon, Nair, Rajesh
Published in Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2014)

by Shun Qiang Gong, Wei Liu, Juan Boon Tan, Bhatkar, Mahesh, Hai Cong, Oswald, Jens, Lo, Eddy, Soh Yun Siah
Published in IEEE International Interconnect Technology Conference (01.05.2014)

by Mario, Hendro, Chee Lip Gan, Yeow Kheng Lim, Juan Boon Tan, Jun Wei, Chookajorn, Tongjai, Thompson, Carl V.
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)

by Leong Ching Wai, Jaafar, N. B., Chew, M., Sivakumar, S., Gunasekaran, G., Kanchet, K., Witarsa, D., Tan Juan Boon, Srinivasa, V. R., Chai, T. C., Alastair, A., Woo, J.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)

by YongKai Zhou, Jie Zhu, AnYan Du, YouNan Hua, SiPing Zhao, Wei Liu, Fan Zhang, Juan Boon Tan
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)

by Tan, Juan Boon, Khor, EeJan, Chockalingam, Ramasamy
Year of Publication 09.07.2024

by Sun, Jianxun, Chen, Tupei, Tan, Juan Boon
Year of Publication 14.11.2023