Search Results - "BOOH, SEONG WOON" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Optically transparent electrorheological fluid with urea-modified silica nanoparticles and its haptic display application

Optically transparent electrorheological fluid with urea-modified silica nanoparticles and its haptic display application

by Liu, Ying Dan, Lee, Bo Mi, Park, Tae-Sang, Kim, Ji Eun, Choi, Hyoung Jin, Booh, Seong Woon
Published in Journal of colloid and interface science (15.08.2013)

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Journal Article

$Transparent thiourea treated silica suspension through refractive index matching method and its electrorheology$

Transparent thiourea treated silica suspension through refractive index matching method and its electrorheology

by Liu, Ying Dan, Lee, Bo Mi, Kim, Ji Eun, Choi, Hyoung Jin, Park, Tae-Sang, Booh, Seong-Woon
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (05.03.2012)

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Journal Article

SYSTEM FOR DESIGNING META LENS

SYSTEM FOR DESIGNING META LENS

by AHN HO YOUNG, PARK HYEON SOO, HAN SEUNG HOON, LEE KYU IL, BOOH SEONG WOON, SHIM MUN BO
Year of Publication 09.06.2023

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Patent

POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE

by LEE, BAIK WOO, BOOH, SEONG WOON
Year of Publication 07.01.2015

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Patent

Finite element contact analysis on a horn-holder assembly for wire bonding

Finite element contact analysis on a horn-holder assembly for wire bonding

by Jang, Changsoo, Ahn, Geun Sik, Kim, Yung Joon, Kwak, Dong Ok, Booh, Seong Woon, Kim, Jae Ok
Published in IEEE transactions on electronics packaging manufacturing (01.01.2003)

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Journal Article

Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging

Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging

by Cho, Moon Gi, Paik, Kyung Wook, Lee, Hyuck Mo, Booh, Seong Woon, Kim, Tae-Gyu
Published in Journal of electronic materials (01.01.2006)

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Journal Article

POWER SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE

by LEE, BAIK WOO, BOOH, SEONG WOON
Year of Publication 10.06.2014

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Patent

BATTERY PACK AND METHOD OF CONTROLLING CHARGING AND DISCHRAGING OF THE BATTERY PACK

BATTERY PACK AND METHOD OF CONTROLLING CHARGING AND DISCHRAGING OF THE BATTERY PACK

by CHO, YONG HEE, JUNG, CHANG HOON, BOOH, SEONG WOON, CHO, EUN SEOG
Year of Publication 03.04.2017

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Patent

SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE COMPRISING THE SAME

SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE COMPRISING THE SAME

by KIM, CHANG SIK, KIM, CHE HEUNG, BOOH, SEONG WOON
Year of Publication 18.08.2014

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Patent

SUBSTRATE FOR POWER MODULE HAVING UNIFORM PARALLEL SWITCHING CHARACTERISTIC AND POWER MODULE COMPRISING THE SAME

SUBSTRATE FOR POWER MODULE HAVING UNIFORM PARALLEL SWITCHING CHARACTERISTIC AND POWER MODULE COMPRISING THE SAME

by BYUN, YOUNG HUN, KIM, CHE HEUNG, BOOH, SEONG WOON
Year of Publication 09.05.2014

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Patent

POWER SEMICONDUCTOR APPARATUS

POWER SEMICONDUCTOR APPARATUS

by LEE, BAIK WOO, JEONG, CHANG MO, BYUN, YOUNG HUN, BOOH, SEONG WOON
Year of Publication 13.05.2015

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Patent

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

by YOON, JEONG WON, LEE, BAIK WOO, JEONG, CHANG MO, BOOH, SEONG WOON
Year of Publication 08.05.2015

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Patent

POWER DEVICE AND POWER DEVICE MODULE

POWER DEVICE AND POWER DEVICE MODULE

by LEE, BAIK WOO, JEONG, CHANG MO, BYUN, YOUNG HUN, BOOH, SEONG WOON
Year of Publication 29.01.2014

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Patent

Multi-layered laminates package and method for manufacturing the same

Multi-layered laminates package and method for manufacturing the same

by LEE, BAIK WOO, LIM, JI HYUK, BOOH, SEONG WOON
Year of Publication 09.02.2012

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Patent

Embedded discrete passives technology for bandage-type medical sensors of E-healthcare system

Embedded discrete passives technology for bandage-type medical sensors of E-healthcare system

by Baik-Woo Lee, Seong Woon Booh, Kunsoo Shin
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

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Conference Proceeding

SYSTEM AND METHOD DESIGNING METALENS

SYSTEM AND METHOD DESIGNING METALENS

by SHIM, MUN BO, HAN, SEUNG HOON, PARK, HYEON SOO, AHN, HO YOUNG, BOOH, SEONG WOON, LEE, KYU IL
Year of Publication 08.06.2023

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Patent

Substrate and terminals for power module and power module including the same

Substrate and terminals for power module and power module including the same

by Kim, Chang-sik, Kim, Che-heung, Booh, Seong-woon
Year of Publication 29.01.2019

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Patent

Substrate and terminals for power module and power module including the same

Substrate and terminals for power module and power module including the same

by Booh Seong-woon, Kim Che-Heung, Kim Chang-Sik
Year of Publication 26.12.2017

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Patent

SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE INCLUDING THE SAME

SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE INCLUDING THE SAME

by KIM Chang-sik, KIM Che-heung, BOOH Seong-woon
Year of Publication 16.11.2017

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Patent

Power semiconductor devices

Power semiconductor devices

by BOOH SEONG-WOON, LEE BAIK-WOO
Year of Publication 21.07.2015

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Patent