Microstructural Optimization of a Zeolite Membrane for Organic Vapor Separation
Lai, Zhiping, Bonilla, Griselda, Diaz, Isabel, Nery, Jose Geraldo, Sujaoti, Khristina, Amat, Miguel A., Kokkoli, Efrosini, Terasaki, Osamu, Thompson, Robert W., Tsapatsis, Michael, Vlachos, Dionisios G.
Published in Science (American Association for the Advancement of Science) (18.04.2003)
Published in Science (American Association for the Advancement of Science) (18.04.2003)
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Journal Article
Zeolite (MFI) Crystal Morphology Control Using Organic Structure-Directing Agents
Bonilla, Griselda, Díaz, Isabel, Tsapatsis, Michael, Jeong, Hae-Kwon, Lee, Yongjae, Vlachos, Dionisios G
Published in Chemistry of materials (28.12.2004)
Published in Chemistry of materials (28.12.2004)
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Journal Article
Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth
Nair, Sankar, Lai, Zhiping, Nikolakis, Vladimiros, Xomeritakis, George, Bonilla, Griselda, Tsapatsis, Michael
Published in Microporous and mesoporous materials (01.11.2001)
Published in Microporous and mesoporous materials (01.11.2001)
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Journal Article
Conference Proceeding
On the path to AI hardware via chiplet integration enabled by high density organic substrates
Bonilla, Griselda, Quinlan, Brian, Wassick, Thomas, Kastberg, Russell, Li, Shidong, Basutkar, Monali
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation
Wu, Ernest, Bolam, Ron, Li, Baozhen, Shen, Tian, Linder, Barry, Bonilla, Griselda, Wang, Miaomiao, Guo, Dechao
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
Du, Yingjie, Xu, Tingge, Shaw, Thomas M., Liu, Xiao Hu, Bonilla, Griselda, Li, Han, Lu, Hongbing
Published in Extreme Mechanics Letters (01.05.2017)
Published in Extreme Mechanics Letters (01.05.2017)
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Journal Article
Creep characterization of solder bumps using nanoindentation
Du, Yingjie, Liu, Xiao Hu, Fu, Boshen, Shaw, Thomas M., Lu, Minhua, Wassick, Thomas A., Bonilla, Griselda, Lu, Hongbing
Published in Mechanics of time-dependent materials (01.08.2017)
Published in Mechanics of time-dependent materials (01.08.2017)
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Journal Article
A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)
Wu, Ernest, Stathis, James, Li, Baozhen, Linder, Barry, Kai Zhao, Bonilla, Griselda
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications
Wu, Ernest, Stathis, James, Baozhen Li, Kim, Andrew, Linder, Barry, Bolam, Ronald, Bonilla, Griselda
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)
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Conference Proceeding
Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth
Bonilla, Griselda, Tsapatsis, Michael, Vlachos, Dionisios G., Xomeritakis, George
Published in Journal of membrane science (15.02.2001)
Published in Journal of membrane science (15.02.2001)
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Journal Article
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
Sakuma, Katsuyuki, Bonilla, Griselda, McHerron, Dale, Aoki, Toyohiro, Kastberg, Russell, Pomerantz, Glenn, Bunt, Jay, Wassick, Tom
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware
Taneja, Divya, Grenier, Jonathan, Ross, Joseph, Mori, Horiyuki, Raghvan, Sathya, Quinlan, Brian, De Sousa, Isabel, Wassick, Thomas, Bonilla, Griselda
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
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Journal Article
ELECTRONIC FUSE HAVING A DAMAGED REGION
FILIPPI RONALD G, ZHANG LIJUAN, SIMON ANDREW H, LI WAI KIN, CHOI SAMUEL S, BAO JUNJING, KALTALIOGU ERDEM, WANG PING CHUAN, LUSTIG NAFTALI E, BONILLA GRISELDA
Year of Publication 13.01.2016
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Year of Publication 13.01.2016
Patent
Electrical Characterization and Modeling of 2-\mu \mathrm and Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer.5-\mu \mathrm$ Line-and-Space High-Density Signal Wiring in Organic Interposer
Watanabe, Atom O., Gu, Xiaoxiong, Libsch, Frank R., Bonilla, Griselda, Mori, Hiroyuki
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding