Search Results - "BONILLA GRISELDA" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Microstructural Optimization of a Zeolite Membrane for Organic Vapor Separation

Microstructural Optimization of a Zeolite Membrane for Organic Vapor Separation

by Lai, Zhiping, Bonilla, Griselda, Diaz, Isabel, Nery, Jose Geraldo, Sujaoti, Khristina, Amat, Miguel A., Kokkoli, Efrosini, Terasaki, Osamu, Thompson, Robert W., Tsapatsis, Michael, Vlachos, Dionisios G.
Published in Science (American Association for the Advancement of Science) (18.04.2003)

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Journal Article

Zeolite (MFI) Crystal Morphology Control Using Organic Structure-Directing Agents

Zeolite (MFI) Crystal Morphology Control Using Organic Structure-Directing Agents

by Bonilla, Griselda, Díaz, Isabel, Tsapatsis, Michael, Jeong, Hae-Kwon, Lee, Yongjae, Vlachos, Dionisios G
Published in Chemistry of materials (28.12.2004)

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Journal Article

Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth

Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth

by Nair, Sankar, Lai, Zhiping, Nikolakis, Vladimiros, Xomeritakis, George, Bonilla, Griselda, Tsapatsis, Michael
Published in Microporous and mesoporous materials (01.11.2001)

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Journal Article Conference Proceeding

Simulations and experiments on the growth and microstructure of zeolite MFI films and membranes made by secondary growth

Simulations and experiments on the growth and microstructure of zeolite MFI films and membranes made by secondary growth

by Bonilla, Griselda, Vlachos, Dionisios G, Tsapatsis, Michael
Published in Microporous and mesoporous materials (01.02.2001)

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Journal Article

Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage

Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage

by Raghavan, Sathya, Mori, Hiroyuki, Bonilla, Griselda, Sakuma, Katsuyuki
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)

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Conference Proceeding

On the path to AI hardware via chiplet integration enabled by high density organic substrates

On the path to AI hardware via chiplet integration enabled by high density organic substrates

by Bonilla, Griselda, Quinlan, Brian, Wassick, Thomas, Kastberg, Russell, Li, Shidong, Basutkar, Monali
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)

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Conference Proceeding

비대칭 다이 본딩

비대칭 다이 본딩

by SAKUMA KATSUYUKI, TUNGA KRISHNA, LI SHIDONG, BONILLA GRISELDA
Year of Publication 04.04.2023

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Patent

A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation

A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation

by Wu, Ernest, Bolam, Ron, Li, Baozhen, Shen, Tian, Linder, Barry, Bonilla, Griselda, Wang, Miaomiao, Guo, Dechao
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)

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Conference Proceeding

A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film

A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film

by Du, Yingjie, Xu, Tingge, Shaw, Thomas M., Liu, Xiao Hu, Bonilla, Griselda, Li, Han, Lu, Hongbing
Published in Extreme Mechanics Letters (01.05.2017)

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Journal Article

Delayed mechanical failure of the under-bump interconnects by bump shearing

Delayed mechanical failure of the under-bump interconnects by bump shearing

by Li, Han, Shaw, Thomas M., Liu, Xiao-Hu, Bonilla, Griselda
Published in Journal of applied physics (15.04.2012)

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Journal Article

A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)

A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)

by Wu, Ernest, Stathis, James, Li, Baozhen, Linder, Barry, Kai Zhao, Bonilla, Griselda
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)

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Conference Proceeding

Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications

Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications

by Wu, Ernest, Stathis, James, Baozhen Li, Kim, Andrew, Linder, Barry, Bolam, Ronald, Bonilla, Griselda
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)

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Conference Proceeding

Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth

Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth

by Bonilla, Griselda, Tsapatsis, Michael, Vlachos, Dionisios G., Xomeritakis, George
Published in Journal of membrane science (15.02.2001)

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Journal Article

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

by Sakuma, Katsuyuki, Bonilla, Griselda, McHerron, Dale, Aoki, Toyohiro, Kastberg, Russell, Pomerantz, Glenn, Bunt, Jay, Wassick, Tom
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

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Conference Proceeding

METHOD FOR FABRICATING SEMICONDUCTOR INTERGRATED CIRCUIT DEVICE AND SEMICONDUCTOR INTERGRATED CIRCUIT DEVICE FABRICATED THEREBY

METHOD FOR FABRICATING SEMICONDUCTOR INTERGRATED CIRCUIT DEVICE AND SEMICONDUCTOR INTERGRATED CIRCUIT DEVICE FABRICATED THEREBY

by WIDODO JOHNNY, KIM, JAE HAK, SHOBHA HOSADURGA, RESTAINO DARRYL D, BONILLA GRISELDA, MOLIS STEVEN E
Year of Publication 12.06.2014

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Patent

Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware

Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware

by Taneja, Divya, Grenier, Jonathan, Ross, Joseph, Mori, Horiyuki, Raghvan, Sathya, Quinlan, Brian, De Sousa, Isabel, Wassick, Thomas, Bonilla, Griselda
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)

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Conference Proceeding

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

by Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee
Published in ECS transactions (26.03.2014)

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Journal Article

ELECTRONIC FUSE HAVING A DAMAGED REGION

ELECTRONIC FUSE HAVING A DAMAGED REGION

by FILIPPI RONALD G, ZHANG LIJUAN, SIMON ANDREW H, LI WAI KIN, CHOI SAMUEL S, BAO JUNJING, KALTALIOGU ERDEM, WANG PING CHUAN, LUSTIG NAFTALI E, BONILLA GRISELDA
Year of Publication 13.01.2016

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Patent

$Electrical Characterization and Modeling of 2-\mu \mathrm and Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer.5-\mu \mathrm$ Line-and-Space High-Density Signal Wiring in Organic Interposer$

Electrical Characterization and Modeling of 2-\mu \mathrm and Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer.5-\mu \mathrm$ Line-and-Space High-Density Signal Wiring in Organic Interposer

by Watanabe, Atom O., Gu, Xiaoxiong, Libsch, Frank R., Bonilla, Griselda, Mori, Hiroyuki
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

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Conference Proceeding

ELECTRONIC SUBSTRATE STACKING

ELECTRONIC SUBSTRATE STACKING

by SHAN, Lei, FRIEDMAN, Daniel, BONILLA, Griselda, KNICKERBOCKER, John
Year of Publication 07.08.2024

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Patent

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