Power semiconductor package with strap
Crowley, Sean T, Anderson, William M, Boland, Bradley D, Bergman, Eelco
Year of Publication 29.03.2005
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Year of Publication 29.03.2005
Patent
Making two lead surface mounting high power microleadframe semiconductor packages
Gillett, Blake A, Crowley, Sean T, Boland, Bradley D, Edwards, Keith M
Year of Publication 29.06.2004
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Year of Publication 29.06.2004
Patent
Power semiconductor package with strap
Crowley, Sean T, Anderson, William M, Boland, Bradley D, Bergman, Eelco
Year of Publication 07.10.2003
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Year of Publication 07.10.2003
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Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe
Crowley, Sean T, Gillett, Blake A, Boland, Bradley D, Mauri, Philip S, Belmonte, Ferdinand E, Burro, Jr., Remigio V, Aquino, Jr., Victor M
Year of Publication 16.03.2004
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Year of Publication 16.03.2004
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Packaging high power integrated circuit devices
MAURI PHILIP S, CROWLEY SEAN T, BURRO REMIGIO V, BELMONTE FERDINAND E, BOLAND BRADLEY D, AQUINO VICTOR M, GILLETT BLAKE A
Year of Publication 24.04.2003
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Year of Publication 24.04.2003
Patent