Search Results - "BOITEAU; JEAN-PIERRE" :: K.UTB vyhledávací portál

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PROCEDE ET DISPOSITIF DE SOUDAGE D'ELEMENTS SUR LES PLOTS CORRESPONDANTS D'UNE PLAQUETTE TELLE QUE NOTAMMENT UNE PLAQUETTE DE CIRCUITS INTEGRES DE HAUTE DENSITE

by MICHEL LE MEAU, JEAN-PIERRE BOITEAU ET JEAN-YVES VERNON
Year of Publication 03.04.1987

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APPARATUS FOR SELECTIVE TIN-PLATING OF THE CONDUCTORS OF A HIGH DENSITY INTEGRATED SUPPORT AND A TIN-PLATING PROCESS UTILIZING SUCH AN APPARATUS

by BERNEUR, CLAUDE, BOITEAU, JEAN-PIERRE
Year of Publication 11.08.1993

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APPARATUS FOR SELECTIVE TINNING OF SUBSTRATE LEADS

by BERNEUR; CLAUDE, BOITEAU; JEAN-PIERRE
Year of Publication 21.01.1992

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PROCEDE ET DISPOSITIF DE SOUDAGE D'ELEMENTS SUR LES PLOTS CORRESPONDANTS D'UNE PLAQUETTE TELLE QUE NOTAMMENT UNE PLAQUETTE DE CIRCUITS INTEGRES DE HAUTE DENSITE

by MICHEL LE MEAU, JEAN-PIERRE BOITEAU ET JEAN-YVES VERNON
Year of Publication 23.02.1990

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Substrate for very large scale integrated circuit and apparatus for selective tinning of the substrate leads

by BERNEUR; CLAUDE, BOITEAU; JEAN-PIERRE
Year of Publication 15.01.1991

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SUPPORT DE CIRCUIT INTEGRE DE HAUTE DENSITE ET APPAREIL D'ETAMAGE SELECTIF DES CONDUCTEURS DU SUPPORT

by JEAN-PIERRE BOITEAU, CLAUDE BERNEUR
Year of Publication 09.11.1990

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SUPPORT DE CIRCUIT INTEGRE DE HAUTE DENSITE ET APPAREIL D'ETAMAGE SELECTIF DES CONDUCTEURS DU SUPPORT

by JEAN-PIERRE BOITEAU, CLAUDE BERNEUR
Year of Publication 29.09.1989

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Apparatus for selective tin-plating of the conductors of a high density integrated support and a tin-plating process utilizing such an apparatus

by BERNEUR, CLAUDE, BOITEAU, JEAN-PIERRE
Year of Publication 27.09.1989

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Method and apparatus for soldering elements on the corresponding pads of a wafer, in particular a wafer having high-density integrated circuits

by BOITEAU; JEAN-PIERRE, LE MEAU; MICHEL, VERNON; JEAN-YVES
Year of Publication 29.03.1988

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Vorrichtung für die selektive Verzinnungen der Leiterbahnen eines Trägers einer integrierten Schaltung mit hoher Dichte und ein eine derartige Vorrichtung verwendendes Verzinnungsverfahren

by BOITEAU, JEAN-PIERRE, F-75016 PARIS, FR, BERNEUR, CLAUDE, F-75016 PARIS, FR
Year of Publication 17.02.1994

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PROCESS AND DEVICE FOR WELDING ELEMENTS ON THE CORRESPONDING SPOTS OF A SUBSTRATE, SUCH AS A HIGH-DENSITY INTEGRATED-CIRCUIT SUBSTRATE

by VERNON, JEAN-YVES, LE MEAU, MICHEL, BOITEAU, JEAN-PIERRE
Year of Publication 09.08.1989

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Process and device for welding elements on the corresponding spots of a substrate, such as a high-density integrated-circuit substrate

by VERNON, JEAN-YVES, LE MEAU, MICHEL, BOITEAU, JEAN-PIERRE
Year of Publication 22.04.1987

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