by Bogatin, Eric
Year of Publication 2022

by Bogatin, Eric
Published in IEEE electromagnetic compatibility magazine (01.01.2023)

by Rao, Aditya, Bogatin, Eric, Piket-May, Melinda, Hadi, Mohammed F.
Published in IEEE transactions on signal and power integrity (07.11.2024)

by Bogatin, Eric, Radhakrishna, Karthik
Published in IEEE electromagnetic compatibility magazine (2017)

by Barnes, Heidi, Bogatin, Eric, Moreira, Jose
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)

by Bogatin, Eric
Published in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) (01.07.2018)

by Simonovich, L, Bogatin, E, Yazi Cao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)

by Deek, Fadi, Piket-May, Melinda, Bogatin, Eric
Published in 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (13.12.2021)

by Rao, Aditya, Bogatin, Eric, Piket-May, Melinda, Hadi, Mohammed
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)

by Rao, Aditya, Sawant, Saish, Bogatin, Eric, Piket-May, Melinda
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)

by Rao, Aditya, Bogatin, Eric, Piket-May, Melinda, Schofield, Dan, Sankarshanan, Balaji, Srivastava, Aakriti
Published in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2022)

by Smith, Larry, Bogatin, Eric
Published in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) (01.07.2018)

by Deek, Fadi, Piket-May, Melinda, Bogatin, Eric
Published in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) (01.07.2018)

by Resso, Mike, Bogatin, Eric, Vatsyayan, Aayushi
Published in 2016 IEEE MTT-S Latin America Microwave Conference (LAMC) (01.12.2016)

by Lee, Tim Wang, de Paulis, Francesco, Resso, Mike, Piket-May, Melinda, Bogatin, Eric
Published in 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI) (10.05.2021)

by Bogatin, Eric
Published in Printed circuit design & manufacture (01.10.2008)

by Bogatin, Eric
Published in Printed circuit design & manufacture (01.05.2008)

by Bogatin, Eric
Published in Printed circuit design & manufacture (01.12.2007)

by Bogatin, Eric
Published in Printed circuit design & manufacture (01.11.2007)

by Bogatin, Eric
Published in Printed circuit design & manufacture (01.11.2007)