핀치 밸브
GOHS MICHAEL, DITTMANN SIMON, BOETTCHER LARS, SCHUBERT JAN EIKE, WEITEMEIER SWEN
Year of Publication 24.03.2023
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Year of Publication 24.03.2023
Patent
Characteristics and aging of PCB embedded power electronics
Randoll, Richard, Asef, Mahmud, Wondrak, Wolfgang, Böttcher, Lars, Schletz, Andreas
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
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Journal Article
Ultrafast Excited-State Excitation Dynamics in a Quasi-Two-Dimensional Light-Harvesting Antenna Based on Ruthenium(II) and Palladium(II) Chromophores
Dietzek, Benjamin, Kiefer, Wolfgang, Blumhoff, Jörg, Böttcher, Lars, Rau, Sven, Walther, Dirk, Uhlemann, Ute, Schmitt, Michael, Popp, Jürgen
Published in Chemistry : a European journal (23.06.2006)
Published in Chemistry : a European journal (23.06.2006)
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Journal Article
Effects of biomaterials for Lab-on-a-chip production on cell growth and expression of differentiated functions of leukemic cell lines
Destro, Federica, Borgatti, Monica, Iafelice, Bruno, Gavioli, Riccardo, Braun, Tanja, Bauer, Jörg, Böttcher, Lars, Jung, Erik, Bocchi, Massimo, Guerrieri, Roberto, Gambari, Roberto
Published in Journal of materials science. Materials in medicine (01.09.2010)
Published in Journal of materials science. Materials in medicine (01.09.2010)
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Journal Article
An Embedded Power Section with GaN HEMTs
Li, Tianyu, Voigt, Christian, Lindemann, Anderas, Boettcher, Lars, Erhardt, Eugen
Published in 2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia) (24.05.2021)
Published in 2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia) (24.05.2021)
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Conference Proceeding
Lab-on-substrate technology platform
Braun, Tanja, Böttcher, Lars, Bauer, Jörg, Jung, Erik, Becker, Karl-Friedrich, Ostmann, Andreas, Aschenbrenner, Rolf, Reichl, Herbert
Published in Physica status solidi. A, Applications and materials science (01.03.2009)
Published in Physica status solidi. A, Applications and materials science (01.03.2009)
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Journal Article
Conference Proceeding
Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond
Schein, Friedrich-Leonhard, Voigt, Christian, Gerhold, Lutz, Tsigaras, Ioannis, Elghazzali, Mohamed, Sawamoto, Hirofumi, Strolz, Ewald, Rettenmeier, Roland, Kahle, Ruben, Bottcher, Lars
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Lamination and laser structuring for a microwell array
Jung, Erik, Manessis, Dion, Neumann, Alexander, Böttcher, Lars, Braun, Tanja, Bauer, Jörg, Reichl, Herbert, Iafelice, Bruno, Destro, Federica, Gambari, Roberto
Published in Microsystem technologies (01.07.2008)
Published in Microsystem technologies (01.07.2008)
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Journal Article
Conference Proceeding
Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates
Schein, Friedrich-Leonhard, Elghazzali, Mohammed, Voigt, Christian, Tsigaras, Ioannis, Sawamoto, Hirofumi, Strolz, Ewald, Rettenmeier, Roland, Bottcher, Lars
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Panel Level Packaging - Where are the Technology Limits?
Braun, Tanja, Holck, Ole, Obst, Mattis, Voges, Steve, Kahle, Ruben, Bottcher, Lars, Billaud, Mathilde, Stobbe, Lutz, Becker, Karl-Friedrich, Aschenbrenner, Rolf, Voitel, Marcus, Schein, Friedrich-Leonhard, Gerholt, Lutz, Schneider-Ramelow, Martin
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Development of innovative substrate and embedding technologies for high frequency applications
Manessis, Dionysios, Kosmider, Stefan, Boettcher, Lars, Seckel, Manuel, Murugesan, Kavin, Maas, Uwe, Ndip, Ivan, Ostmann, Andreas, Aschenbrenner, Rolf, Schneider-Ramelow, Martin, Lang, K-D.
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
PINCH VALVE
DITTMANN, Simon, WEITEMEIER, Swen, GOHS, Michael, SCHUBERT, Jan-Eike, BOETTCHER, Lars
Year of Publication 22.06.2023
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Year of Publication 22.06.2023
Patent