Electronic device console with natural draft cooling
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Year of Publication 21.11.2023
Patent
ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING
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Year of Publication 21.01.2021
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Year of Publication 21.01.2021
Patent
Electronic device console with natural draft cooling
Sikka, Kamal K, Bodenweber, Paul F, Lian, Chenzhou, Casey, Jon A, Rivera, Kathryn C
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Year of Publication 10.11.2020
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Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 26.01.2021
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Year of Publication 26.01.2021
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Measurements of interfacial strengths in underfilled flip-chip electronic packages using Wedge Delamination Method (WDM)
Sinha, Tuhin, Sikka, Kamal K., Yannitty, David N., Bodenweber, Paul F.
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 25.08.2020
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Year of Publication 25.08.2020
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COOLING STRUCTURE FOR ELECTRONIC BOARDS
BODENWEBER, Paul F, MARSTON, Kenneth C, TOY, Hilton T, ZITZ, Jeffrey A, SIKKA, Kamal K, WERNER, Randall J
Year of Publication 27.02.2020
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Year of Publication 27.02.2020
Patent
Cooling structure for electronic boards
Sikka, Kamal K, Werner, Randall J, Bodenweber, Paul F, Zitz, Jeffrey A, Toy, Hilton T, Marston, Kenneth C
Year of Publication 21.01.2020
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Year of Publication 21.01.2020
Patent
COOLING STRUCTURE FOR ELECTRONIC BOARDS
BODENWEBER, Paul F, MARSTON, Kenneth C, TOY, Hilton T, ZITZ, Jeffrey A, SIKKA, Kamal K, WERNER, Randall J
Year of Publication 31.10.2019
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Year of Publication 31.10.2019
Patent