Air-gaps in 0.3 μm electrical interconnections
Kohl, P.A., Bhusari, D.M., Wedlake, M., Case, C., Klemens, F.P., Miner, J., Byung-Chan Lee, Gutmann, R.J., Shick, R.
Published in IEEE electron device letters (01.12.2000)
Published in IEEE electron device letters (01.12.2000)
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Journal Article
Carbon nanotube-composite wafer bonding for ultra-high efficiency III-V multijunction solar cells
Boca, Andreea, Boisvert, Joseph C, Law, Daniel C, Mesropian, Shoghig, Karam, Nasser H, Hong, William D, Woo, Robyn L, Bhusari, Dhananjay M, Turevskaya, Evgeniya, Mack, Patrick, Glatkowski, Paul
Published in 2010 35th IEEE Photovoltaic Specialists Conference (01.06.2010)
Published in 2010 35th IEEE Photovoltaic Specialists Conference (01.06.2010)
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Conference Proceeding