Location resolved transient thermal analysis to investigate crack growth in solder joints
Liu, E., Zahner, Thomas, Besold, Sebastian, Wunderle, Bernhard, Elger, Gordon
Published in Microelectronics and reliability (01.12.2017)
Published in Microelectronics and reliability (01.12.2017)
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Journal Article
Transient thermal simulation of high power LED and its challenges
Tandon, Sanchit, Liu, E., Zahner, Thomas, Besold, Sebastian, Kalb, Wolfgang, Elger, Gordon
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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Conference Proceeding
Calibration of transient FE simulation: Improvement of post-processing and simulation automation
Saparia, Siddharth, Tandon, Sanchit, Liu, E., Zahner, Thomas, Besold, Sebastian, Kalb, Wolfgang, Elger, Gordon
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2017)
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2017)
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Conference Proceeding