Search Results - "BERGER DANIEL G" :: K.UTB vyhledávací portál

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Interface adhesive compsn. and rework prepn

by SACHDEV KRISHNA G.,BERGER DANIEL G.,CHIOUJONES KELLY M.,DAVES GLENN G.,TOY HILTON T
Year of Publication 16.11.2005

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Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration

by Graves-Abe, Troy L, Berger, Daniel G, Kirihata, Toshiaki, Iyer, Subramanian S, Kumar, Arvind, Wilcke, Winfried W
Year of Publication 07.04.2020

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ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING AN ARCHITECTURE USING 3D WAFER SCALE INTEGRATION

by Graves-Abe, Troy L, Berger, Daniel G, Kirihata, Toshiaki, Iyer, Subramanian S, Kumar, Arvind, Wilcke, Winfried W
Year of Publication 06.02.2020

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Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration

by Graves-Abe, Troy L, Berger, Daniel G, Kirihata, Toshiaki, Iyer, Subramanian S, Kumar, Arvind, Wilcke, Winfried W
Year of Publication 10.12.2019

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ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING AN ARCHITECTURE USING 3D WAFER SCALE INTEGRATION

by Graves-Abe, Troy L, Berger, Daniel G, Kirihata, Toshiaki, Iyer, Subramanian S, Kumar, Arvind, Wilcke, Winfried W
Year of Publication 17.05.2018

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Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration

by Graves-Abe Troy L, Kumar Arvind, Iyer Subramanian S, Kirihata Toshiaki, Wilcke Winfried W, Berger Daniel G
Year of Publication 06.02.2018

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ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING AN ARCHITECTURE USING 3D WAFER SCALE INTEGRATION

by WILCKE, Winfried W, GRAVES-ABE, Troy L, KUMAR, Arvind, BERGER, Daniel G, IYER, Subramanian S, KIRIHATA, Toshiaki
Year of Publication 24.11.2016

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ARCHITECTURE AND IMPLEMENTATION OF CORTICAL SYSTEM, AND FABRICATING AN ARCHITECTURE USING 3D WAFER SCALE INTEGRATION

by Graves-Abe Troy L, Kumar Arvind, Iyer Subramanian S, Kirihata Toshiaki, Wilcke Winfried W, Berger Daniel G
Year of Publication 17.11.2016

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THERMAL INTERFACE ADHESIVE AND REWORK

by DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 17.12.2009

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HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING

by MICHEL BRUNO, BEZAMA RASCHID J, BERGER DANIEL G, HERRON LESTER W, NATARAJAN GOVINDARAJAN
Year of Publication 13.03.2008

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UV-curable solvent free compositions and use thereof in ceramic chip defect repair

by Sachdev, Krishna G, Berger, Daniel G, Chioujones, Kelly M, Quinlan, Brian W
Year of Publication 12.02.2008

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UV-curable solvent free compositions and use thereof in ceramic chip defect repair

by QUINLAN BRIAN W, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 12.02.2008

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CONDUCTIVE ADHESIVE REWORK METHOD

by DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 24.01.2008

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CONDUCTIVE ADHESIVE COMPOSITION

by DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 22.11.2007

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High performance integrated MLC cooling device for high power density ICS and method for manufacturing

by MICHEL BRUNO, BEZAMA RASCHID J, BERGER DANIEL G, HERRON LESTER W, NATARAJAN GOVINDARAJAN
Year of Publication 14.08.2007

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High performance integrated MLC cooling device for high power density ICS and method for manufacturing

by Berger, Daniel G, Bezama, Raschid J, Herron, Lester W, Michel, Bruno, Natarajan, Govindarajan
Year of Publication 14.08.2007

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HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING

by MICHEL BRUNO, BEZAMA RASCHID J, BERGER DANIEL G, HERRON LESTER W, NATARAJAN GOVINDARAJAN
Year of Publication 30.11.2006

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Device and method for controlling hot substrate

by BERGER DANIEL G.,BEZAMA RASCHID J.,HERRON LESTER W.,MICHEL BRUNO,NATARAJAN GOVINDARAJAN
Year of Publication 29.11.2006

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UV-curable solvent free compositions and use thereof in ceramic chip defect repair

by QUINLAN BRIAN W, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 30.03.2006

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Temporary chip attach method using reworkable conductive adhesive interconnections

by INDYK RICHARD F, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 19.01.2006

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