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Year of Publication 30.09.2016
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Hybrid interconnect for low temperature attach
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Year of Publication 13.02.2019
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Year of Publication 13.02.2019
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Hybrid interconnect for low temperature attach
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Year of Publication 04.01.2017
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Year of Publication 08.09.2016
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HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
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Year of Publication 01.10.2015
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Hybride Zwischenverbindung für Niedertemperatur-Befestigung
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Year of Publication 01.12.2016
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Year of Publication 01.12.2016
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Hybrid interconnect for low temperature attach
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Year of Publication 12.10.2016
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Year of Publication 12.10.2016
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Characterization and modeling of non-linear inelastic behavior of organic packages at component and system levels
Tieyu Zheng, Min Tao, Nardi, P., Modi, M., Sane, S., Bekar, I.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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