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"BAYLESS, Andrew M"
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"BAYLESS, Andrew M"
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BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS AND ASSOCIATED SYSTEMS AND METHODS
by
BAYLESS CASSIE L
,
BAYLESS ANDREW M
Year of Publication
09.07.2020
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BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS AND ASSOCIATED SYSTEMS AND METHODS
by
BAYLESS CASSIE L
,
BAYLESS ANDREW M
Year of Publication
09.07.2020
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Package cooling by coil cavity
by
HUANG WAYNE H
,
FAY OWEN R
,
BAYLESS ANDREW M
Year of Publication
09.07.2020
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FERROMAGNETIC CONTROL OF WAFER BONDING
by
BAYLESS
,
Andrew M
Year of Publication
09.05.2024
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RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LASER RELEASE
by
Bayless
,
Andrew M
Year of Publication
17.06.2021
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SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS
by
Bayless
,
Andrew M
,
Minnich, Jeremy E
Year of Publication
04.07.2024
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Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
16.04.2024
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SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
04.01.2024
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MICROELECTRONIC DEVICES AND RELATED METHODS OF FABRICATING MICROELECTRONIC DEVICES
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
04.01.2024
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METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE SEPARATION
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
04.01.2024
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THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
28.12.2023
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Apparatus for processing device structures
by
Bayless
,
Andrew M
Year of Publication
18.08.2020
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Thin die release for semiconductor device assembly
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
17.10.2023
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Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
10.10.2023
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Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
10.10.2023
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Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
03.10.2023
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Method for semiconductor die edge protection and semiconductor die separation
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
19.09.2023
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SEPARATION METHOD AND ASSEMBLY FOR CHIP-ON-WAFER PROCESSING
by
Bitz, Bradley R
,
Bayless
,
Andrew M
Year of Publication
24.08.2023
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Separation method and assembly for chip-on-wafer processing
by
Bitz, Bradley R
,
Bayless
,
Andrew M
Year of Publication
13.06.2023
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Recessed semiconductor devices, and associated systems and methods
by
Bayless
,
Andrew M
,
Wirz, Brandon P
Year of Publication
09.05.2023
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