Search Results - "BAVANESI, VINAY" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Back grinding adhesive tape for cross-linked semiconductor wafer

Back grinding adhesive tape for cross-linked semiconductor wafer

by SHEN WENHAO, BAVANESI, VINAY, SINGH HARINDER VIJAYKUMAR, SHAH ANKUR H
Year of Publication 05.07.2024

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Patent

Embedded trace substrate assemblies and related microelectronic device assemblies, electronic systems, and processes

Embedded trace substrate assemblies and related microelectronic device assemblies, electronic systems, and processes

by CHOI BONG-WOO, BAVANESI, VINAY, SAIKAM NADER R
Year of Publication 08.03.2024

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Patent

Structure and method for dicing semiconductor device

Structure and method for dicing semiconductor device

by WANG WEIZHANG, BAVANESI, VINAY, KWON YOUNG-IK, COTY, ROBERT, DELLAL BENJAMIN, BANSAL RAJESH KUMAR
Year of Publication 12.09.2023

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Patent