Variance Analysis in 3-D Integration: A Statistically Unified Model With Distance Correlations
Ayres, Alexandre, Rozeau, Olivier, Borot, Bertrand, Fesquet, Laurent, Batude, Perrine, Brunet, Laurent, Vinet, Maud
Published in IEEE transactions on electron devices (01.01.2019)
Published in IEEE transactions on electron devices (01.01.2019)
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Journal Article
Total-Ionizing-Dose Effects on 3-D Sequentially Integrated FDSOI Ring Oscillators
Toguchi, Shintaro, Zhang, En Xia, Fleetwood, Daniel M., Schrimpf, Ronald D., Moreau, Stephane, Batude, Perrine, Brunet, Laurent, Andrieu, Francois, Alles, Michael L.
Published in IEEE transactions on nuclear science (01.04.2023)
Published in IEEE transactions on nuclear science (01.04.2023)
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Journal Article
Effects of Layer-to-Layer Coupling on the Total-Ionizing-Dose Response of 3-D-Sequentially Integrated FD-SOI MOSFETs
Toguchi, Shintaro, Zhang, En Xia, Rony, Mohammed W., Luo, Xuyi, Fleetwood, Daniel M., Schrimpf, Ronald D., Moreau, Stephane, Cheramy, Severine, Batude, Perrine, Brunet, Laurent, Andrieu, Francois, Alles, Michael L.
Published in IEEE Transactions on Nuclear Science (01.07.2022)
Published in IEEE Transactions on Nuclear Science (01.07.2022)
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Journal Article
Publication
Total-Ionizing-Dose Effects on 3D Sequentially Integrated, Fully Depleted Silicon-on-Insulator MOSFETs
Toguchi, Shintaro, Zhang, En Xia, Gorchichko, Mariia, Fleetwood, Daniel M., Schrimpf, Ronald D., Reed, Robert A., Moreau, Stephane, Cheramy, Severine, Batude, Perrine, Brunet, Laurent, Andrieu, Francois, Alles, Michael L.
Published in IEEE electron device letters (01.04.2020)
Published in IEEE electron device letters (01.04.2020)
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Journal Article
Charge Trapping and Transconductance Degradation in Irradiated 3-D Sequentially Integrated FDSOI MOSFETs
Toguchi, Shintaro, Zhang, En Xia, Fleetwood, Daniel M., Schrimpf, Ronald D., Reed, Robert A., Moreau, Stephane, Cheramy, Severine, Batude, Perrine, Brunet, Laurent, Andrieu, Francois, Alles, Michael L.
Published in IEEE Transactions on Nuclear Science (01.05.2021)
Published in IEEE Transactions on Nuclear Science (01.05.2021)
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Journal Article
Publication
Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel
Sideris, Petros, Peizerat, Arnaud, Batude, Perrine, Sicard, Gilles, Theodorou, Christoforos
Published in Technologies (Basel) (01.04.2022)
Published in Technologies (Basel) (01.04.2022)
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Journal Article
Integration of Low Temperature SiGe:B Raised Sources and Drains in p-Type FDSOI Field Effect Transistors
Lu, Cao-Minh Vincent, Fenouillet-Beranger, Claire, Hartmann, Jean-Michel, Rodriguez, Philippe, Benevent, Véronique, Samson, Marie-Pierre, Previtali, Bernard, Tabone, Claude, Cassé, Mikael, Allain, Fabienne, Romano, Giovanni, Brunet, Laurent, Batude, Perrine, Skotnicki, Thomas, Vinet, Maud
Published in ECS transactions (18.08.2016)
Published in ECS transactions (18.08.2016)
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Journal Article
Enabling 3D Monolithic Integration
Batude, Perrine, Vinet, Maud, Pouydebasque, Arnaud, Clavelier, Laurent, LeRoyer, Cyrille, Tabone, Claude, Previtali, Bernard, Sanchez, Loic, Baud, Laurence, Roman, Antonio, Carron, Véronique, Nemouchi, Fabrice, Pocas, Stéphane, Comboroure, Corine, Mazzocchi, Vincent, Grampeix, Helen, Aussenac, François, Deleonibus, Simon
Published in ECS transactions (03.10.2008)
Published in ECS transactions (03.10.2008)
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Journal Article
Variance Analysis in 3D Integration: A statistically Unified Model with Distance Correlations
Ayres de Sousa, Alexandre, Rozeau, Olivier, Borot, Bertrand, Fesquet, Laurent, Batude, Perrine, Brunet, Laurent, Vinet, Maud
Published in IEEE transactions on electron devices (01.01.2019)
Published in IEEE transactions on electron devices (01.01.2019)
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Journal Article
Parasitic coupling in 3D equential integration: the example of a two-layer 3D pixel
Sideris, Petros, Peizerat, Arnaud, Batude, Perrine, Sicard, Gilles, Theodorou, Christoforos
Published in Technologies (Basel) (28.02.2022)
Published in Technologies (Basel) (28.02.2022)
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Journal Article
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC
Thuries, Sebastien, Billoint, Olivier, Choisnet, Sylvain, Lemaire, Romain, Vivet, Pascal, Batude, Perrine, Lattard, Didier
Published in 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2020)
Published in 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2020)
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Conference Proceeding
An atomistic investigation of the composition dependence in SiGe alloys during Solid Phase Epitaxial Regrowth
Payet, Anthony, Sklénard, Benoît, Barbé, Jean-Charles, Batude, Perrine, Tavernier, Clément, Gergaud, Patrice, Martin-Bragado, Ignacio
Published in Acta materialia (01.03.2016)
Published in Acta materialia (01.03.2016)
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Journal Article
Dielectrics stability for intermediate BEOL in 3D sequential integration
Deprat, Fabien, Fenouillet-Beranger, Claire, Jousseaume, Vincent, Guerin, Chloé, Beugin, Virginie, Rochat, Névine, Licitra, Christophe, Caubet-Hilloutou, Véronique, Benoit, Daniel, Imbert, Gregory, Rambal, Nils, Batude, Perrine, Vinet, Maud
Published in Microelectronic engineering (05.01.2017)
Published in Microelectronic engineering (05.01.2017)
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Journal Article
(Invited) 3D Monolithic Integration
Brunet, Laurent, Batude, Perrine, Fenouillet-Beranger, Claire, Vinet, Maud
Published in ECS transactions (10.04.2018)
Published in ECS transactions (10.04.2018)
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Journal Article
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS
Batude, P., Ernst, T., Arcamone, J., Arndt, G., Coudrain, P., Gaillardon, P.-E
Published in IEEE journal on emerging and selected topics in circuits and systems (01.12.2012)
Published in IEEE journal on emerging and selected topics in circuits and systems (01.12.2012)
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Journal Article
Thermal stability enhancement of Ni-based silicides, germano-silicides and germanides using W and F implantation for 3D CMOS sequential integration
Carron, Veronique, Nemouchi, Fabrice, Milesi, Frederic, Morand, Yves, Batude, Perrine, Hutin, Louis, Le Royer, Cyrille
Published in 2014 International Workshop on Junction Technology (IWJT) (01.05.2014)
Published in 2014 International Workshop on Junction Technology (IWJT) (01.05.2014)
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Conference Proceeding
Technological enhancers effect on Ni0.9Co0.1 silicide stability for 3D sequential integration
Deprat, Fabien, Nemouchi, Fabrice, Fenouillet-Beranger, Claire, Rodriguez, Philippe, Joblot, Sylvain, Gregoire, Magali, Barge, David, Gergaud, Patrice, Rambal, Nils, Batude, Perrine, Vinet, Maud
Published in Physica status solidi. C (01.12.2016)
Published in Physica status solidi. C (01.12.2016)
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Journal Article
Technological enhancers effect on Ni 0.9 Co 0.1 silicide stability for 3D sequential integration
Deprat, Fabien, Nemouchi, Fabrice, Fenouillet‐Beranger, Claire, Rodriguez, Philippe, Joblot, Sylvain, Gregoire, Magali, Barge, David, Gergaud, Patrice, Rambal, Nils, Batude, Perrine, Vinet, Maud
Published in Physica status solidi. C (01.12.2016)
Published in Physica status solidi. C (01.12.2016)
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Journal Article
Technological enhancers effect on Ni sub(0.9)Co sub(0.1) silicide stability for 3D sequential integration
Deprat, Fabien, Nemouchi, Fabrice, Fenouillet-Beranger, Claire, Rodriguez, Philippe, Joblot, Sylvain, Gregoire, Magali, Barge, David, Gergaud, Patrice, Rambal, Nils, Batude, Perrine, Vinet, Maud
Published in Physica status solidi. C (01.12.2016)
Published in Physica status solidi. C (01.12.2016)
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Journal Article
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors
Vivet, Pascal, Sicard, Gilles, Millet, Laurent, Chevobbe, Stephane, Chehida, Karim Ben, Angel Cubero, Luis, Alegre, Monte, Bouvier, Maxence, Valentian, Alexandre, Lepecq, Maria, Dombek, Thomas, Bichler, Olivier, Thuries, Sebastien, Lattard, Didier, Severine, Cheramy, Batude, Perrine, Clermidy, Fabien
Published in 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2019)
Published in 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2019)
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Conference Proceeding