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"BAO XUSHENG"
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"BAO XUSHENG"
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Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
by
ZUO JIAN
,
HLAING MA PHOO PWINT
,
BAO XUSHENG
Year of Publication
22.09.2015
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Surface acoustic wave filter packaging structure
by
WANG JINLONG
,
KONG HAISHEN
,
BAO XUSHENG
,
XU LINHUA
Year of Publication
26.08.2015
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23
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Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration
by
ZUO JIAN
,
HLAING MA PHOO PWINT
,
BAO XUSHENG
Year of Publication
02.04.2015
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Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP
by
BAO
,
XUSHENG
,
SZETO, KWOKKEUNG
Year of Publication
01.01.2015
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Semiconductor device and method of stacking semiconductor die on a fan-out wlcsp
by
SZETO KWOKKEUNG
,
BAO XUSHENG
Year of Publication
31.12.2014
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26
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Anti-static substrate structure
by
LI ZHUYUAN
,
BAO XUSHENG
,
WU YONGYOU
Year of Publication
16.06.2020
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27
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Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
by
ZUO JIAN
,
HLAING MA PHOO PWINT
,
BAO XUSHENG
Year of Publication
24.02.2015
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Substrate layer deviation alignment test strip
by
LI ZHUYUAN
,
BAO XUSHENG
,
WU YONGYOU
Year of Publication
31.03.2020
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Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
by
FANG JIANMIN
,
CHEN KANG
,
FENG XIA
,
LIN YAOJIAN
,
BAO XUSHENG
Year of Publication
20.11.2014
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Semiconductor device and method of forming insulating layer around semiconductor die
by
FANG JIANMIN
,
CHEN KANG
,
FENG XIA
,
LIN YAOJIAN
,
BAO XUSHENG
Year of Publication
04.11.2014
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31
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Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
by
FANG JIANMIN
,
CHEN KANG
,
LIN YAOJIAN
,
BAO XUSHENG
Year of Publication
28.08.2014
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Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP
by
FANG JIANMIN
,
CHEN KANG
,
LIN YAOJIAN
,
BAO XUSHENG
Year of Publication
05.08.2014
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Semiconductor device and method of forming interconnect structure in non-active area of wafer
by
Jang, TaeHoan
,
Ku, JaeHun
,
Bao
,
XuSheng
Year of Publication
06.03.2012
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34
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Chip packaging structure with implanted damper and packaging method
by
CHEN LIHONG
,
SHEN GUOQIANG
,
SUN XIAOFEI
,
BAO XUSHENG
Year of Publication
02.08.2019
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Substrate layer deviation alignment test strip and monitoring method thereof
by
LI ZHUYUAN
,
BAO XUSHENG
,
WU YONGYOU
Year of Publication
19.07.2019
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Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
by
HUANG RUI
,
LIM LEE SUN
,
HLAING MA PHOO PWINT
,
BAO XUSHENG
,
CHOW SENG GUAN
Year of Publication
02.02.2016
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Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability
by
Bao
,
Xusheng
,
Lin, Yaojian
,
Jang, Tae Hoan
Year of Publication
02.08.2011
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Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability
by
JANG TAE HOAN
,
BAO XUSHENG
,
LIN YAOJIAN
Year of Publication
02.08.2011
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Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof
by
HUANG RUI
,
CHEN KANG
,
HSIAO YUNG KUAN
,
BAO XUSHENG
,
GOH HIN HWA
Year of Publication
12.01.2016
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Aquaculture intelligent monitoring front -end processor
by
WANG XIN
,
LUO XUEEN
,
ZHANG LU
,
BAO XUSHENG
,
YU JIANJIAN
Year of Publication
30.12.2015
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