Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
Jun, So-Yeon, Bang, Jung-Hwan, Kim, Min-Su, Han, Deok-Gon, Lee, Tae-Young, Yoo, Sehoon
Published in Materials (20.02.2023)
Published in Materials (20.02.2023)
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Journal Article
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
Lee, Byung-Suk, Ko, Yong-Ho, Bang, Jung-Hwan, Lee, Chang-Woo, Yoo, Sehoon, Kim, Jun-Ki, Yoon, Jeong-Won
Published in Microelectronics and reliability (01.04.2017)
Published in Microelectronics and reliability (01.04.2017)
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Journal Article
Effects of post plasma treatment on material properties and device characteristics in indium zinc oxide thin film transistors
Kim, Won, Bang, Jung-Hwan, Uhm, Hyun-Seok, Lee, Sang-Hyuk, Park, Jin-Seok
Published in Thin solid films (30.12.2010)
Published in Thin solid films (30.12.2010)
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Journal Article
Conference Proceeding
The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
Park, Yujin, Bang, Jung-Hwan, Oh, Chul, Hong, Won, Kang, Namhyun
Published in Metals (Basel ) (01.12.2017)
Published in Metals (Basel ) (01.12.2017)
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Journal Article
Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)
Kim, Jeonga, Park, Cheolho, Cho, Kyung-Mox, Hong, Wonsik, Bang, Jung-Hwan, Ko, Yong-Ho, Kang, Namhyun
Published in Electronic materials letters (01.11.2018)
Published in Electronic materials letters (01.11.2018)
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Journal Article
Effects of additive gases and plasma post-treatment on electrical properties and optical transmittance of ZnO thin films
Bang, Jung-Hwan, Uhm, Hyun-Seok, Kim, Won, Park, Jin-Seok
Published in Thin solid films (30.12.2010)
Published in Thin solid films (30.12.2010)
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Journal Article
Conference Proceeding
Role of O2/Ar mixing ratio on the performances of IZO thin film transistors fabricated using a two-step deposition process
KIM, Won, LEE, Sang-Hyuk, BANG, Jung-Hwan, UHM, Hyun-Seok, PARK, Jin-Seok
Published in Thin solid films (30.12.2011)
Published in Thin solid films (30.12.2011)
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Conference Proceeding
Journal Article
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
Seo, Wonil, Kim, Kyoung-Ho, Bang, Jung-Hwan, Kim, Mok-Soon, Yoo, Sehoon
Published in Journal of electronic materials (01.12.2014)
Published in Journal of electronic materials (01.12.2014)
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Journal Article