Low resistance package for semiconductor devices
BAJE, GILMORE S., SNAPP, STEVEN P, ESTACIO, MARIA CHRISTINA B, TANGPUZ, CONSUELO N, BENCUYA, IZAK
Year of Publication 21.02.2001
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Year of Publication 21.02.2001
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Improved method of making a chip device
GESTOLE, MARVIN R, QUINONES, MARIA CLEMENS Y, LEDON, OLIVER M., ESTACIO, MARIA CHRISTINA B, BAJE, GILMORE S
Year of Publication 21.04.2003
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Year of Publication 21.04.2003
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Low Resistance package for semiconductor devices
Bencuya, Izak, Estacio, Maria Christina B, Sapp, Steven P, Tangpuz, Consuelo N, Baje, Gilmore S, Maligro, Rey D
Year of Publication 23.07.2002
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Year of Publication 23.07.2002
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Low Resistance package for semiconductor devices
BENCUYA IZAK, ESTACIO MARIA CHRISTINA B, SAPP STEVEN P, MALIGRO REY D, BAJE GILMORE S, TANGPUZ CONSUELO N
Year of Publication 23.07.2002
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Year of Publication 23.07.2002
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IMPROVED METHOD OF MANUFACTURING CHIP DEVICE
GESTOLE MARVIN R, ESTACIO MARIA CHRISTINA B, LEDON OLIVER M, MEPIEZA SANTOS, QUINONES MARIA CLEMENS Y, BAJE GILMORE S
Year of Publication 21.09.2001
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Year of Publication 21.09.2001
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Multiple chip component with wireless packing has dies or chip elements with bumps on lower line frames, upper line frames coupled to dies, connecting rails interconnected in pairs
QUINONES, MARIA CLEMENS Y, LEDON, OLIVER M, ESTACIO, MARIA CHRISTINA B, BAJE, GILMORE S, MEPIEZA, SANTOS, GESTOLE, MARVIN A
Year of Publication 16.08.2001
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Year of Publication 16.08.2001
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LOW RESISTANCE PACKAGE FOR SEMICONDUCTOR DEVICES
BAJE, GILMORE, S, TANGPUZ, CONSUELO, N, MALIGRO, REY, D, SNAPP, STEVEN, P, BENCUYA, IZAK, ESTACIO, MARIA, CHRISTINA, B
Year of Publication 27.04.2000
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Year of Publication 27.04.2000
Patent
LOW RESISTANCE PACKAGE FOR SEMICONDUCTOR DEVICES
BAJE, GILMORE, S, TANGPUZ, CONSUELO, N, MALIGRO, REY, D, SNAPP, STEVEN, P, BENCUYA, IZAK, ESTACIO, MARIA, CHRISTINA, B
Year of Publication 16.12.1999
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Year of Publication 16.12.1999
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