Observations of IMC Formation for Au Wire Bonds to Al Pads
DeLucca, John, Osenbach, John, Baiocchi, Frank
Published in Journal of electronic materials (01.04.2012)
Published in Journal of electronic materials (01.04.2012)
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Journal Article
ENIG Corrosion Induced by Second-Phase Precipitation
Osenbach, John, Amin, Ahmed, Baiocchi, Frank, DeLucca, John
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Asymmetric gate resistor power MOSFET
Jun Wang, Shuming Xu, Korec, J., Baiocchi, F.
Published in 2012 24th International Symposium on Power Semiconductor Devices and ICs (01.06.2012)
Published in 2012 24th International Symposium on Power Semiconductor Devices and ICs (01.06.2012)
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Conference Proceeding
SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE
BAIOCCHI FRANK, DELUCCA JOHN, OSENBACH JOHN, AMIN AHMED, VACCARO BRIAN T
Year of Publication 20.09.2010
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Year of Publication 20.09.2010
Patent
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
DELUCCA JOHN M, OSENBACH JOHN W, AMIN AHMED, XIONG ZHENGPENG, BACHMAN MARK ADAM, BAIOCCHI FRANK A
Year of Publication 02.04.2010
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Year of Publication 02.04.2010
Patent