Search Results - "BAI ZHANZHENG" :: K.UTB vyhledávací portál

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High-reliability epoxy bottom filling glue and preparation method thereof

by BAI ZHANZHENG, NIU QINGSHAN, WANG JIANBIN, CHEN TIANAN
Year of Publication 03.02.2016

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Non-flowing epoxy underfill material and preparation method thereof

by BAI ZHANZHENG, NIU QINGSHAN, WANG JIANBIN, CHEN TIANAN
Year of Publication 25.11.2015

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Preparation method of epoxy latent curing agent

by CHEN TIAN'AN, BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN
Year of Publication 16.04.2019

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Epoxy adhesive glue cured rapidly at ultra-low temperature and preparation method of epoxy adhesive glue

by CHEN TIAN'AN, BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN
Year of Publication 19.02.2019

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Epoxy adhesive realizing UV and heat dual-curing and preparation method of epoxy adhesive

by CHEN TIAN'AN, BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN
Year of Publication 06.04.2018

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Moisture cured polyamide hot melt adhesive and preparation method thereof

by CHEN TIAN'AN, BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN
Year of Publication 06.03.2018

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Preparation method for polyester amide hot melt adhesive

by CHEN TIAN'AN, BAI ZHANZHENG, CHEN JIALI, XIE HAIHUA, WANG JIANBIN
Year of Publication 31.05.2017

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Low-temperature fast-curing single-component epoxy adhesive and preparation method thereof

by CHEN TIAN'AN, BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN
Year of Publication 05.04.2017

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Fast positioning single-ingredient epoxy bonding glue and preparation method thereof

by BAI ZHANZHENG, NIU QINGSHAN, WANG JIANBIN, CHEN TIANAN
Year of Publication 07.12.2016

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Copolyamide hot melt adhesive and its preparation method

by BAI ZHANZHENG, WANG JIANBIN, CHEN TIANAN
Year of Publication 02.07.2014

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Acrylic ester modified epoxy bottom filling material and preparation method thereof

by BAI ZHANZHENG, NIU QINGSHAN, WANG JIANBIN, CHEN TIANAN
Year of Publication 19.11.2014

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Copolyamide hot melt adhesive and its preparation method

by BAI ZHANZHENG, WANG JIANBIN, CHEN TIANAN
Year of Publication 09.05.2012

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Polyamide resin with low softening point and preparation method thereof

by BAI ZHANZHENG, WANG JIANBIN, CHEN TIANAN
Year of Publication 04.04.2012

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Flexible underfill and preparation method thereof

by CHEN TIAN'AN, BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN
Year of Publication 12.02.2014

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Low-viscosity dimer acid type polyamine hot melt adhesive and preparation method thereof

by BAI ZHANZHENG, WANG JIANBIN, CHEN TIANAN
Year of Publication 02.02.2011

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Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive

by BAI ZHANZHENG, XIE HAIHUA, WANG JIANBIN, CHEN TIANAN
Year of Publication 02.01.2013

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Epoxide resin pouring sealant with low density and high impact resistance and preparation method thereof

by LUO XUEFANG, BAI ZHANZHENG, HUANG YIGANG, ZHAO XIULI, WANG JIANHUA, LUO SHIKAI
Year of Publication 27.06.2012

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Aqueous photo-curing polyurethane resin and preparation thereof

by LUO XUEFANG, BAI ZHANZHENG, HUANG YIGANG, ZHAO XIULI, TIAN CHUNRONG, LUO SHIKAI
Year of Publication 23.05.2012

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Epoxide resin pouring sealant with low density and high impact resistance and preparation method thereof

by LUO XUEFANG, BAI ZHANZHENG, HUANG YIGANG, ZHAO XIULI, WANG JIANHUA, LUO SHIKAI
Year of Publication 18.11.2009

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Aqueous photo-curing polyurethane resin and preparation thereof

by LUO XUEFANG, BAI ZHANZHENG, HUANG YIGANG, ZHAO XIULI, TIAN CHUNRONG, LUO SHIKAI
Year of Publication 25.02.2009

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