Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics
Kim, Min-Ki, Park, Soojeoung, Jang, Aeni, Lee, Hyuekjae, Baek, Seungduk, Lee, ChungSun, Kim, Ilhwan, Park, Jumyong, Jee, Youngkun, Kang, Un-Byoung, Kim, Dae-Woo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology
Lee, Sanghoon, Jee, Youngkun, Park, Sangcheon, Lee, Soohwan, Hwang, Bohee, Jo, Gyeongjae, Lee, Chungsun, Park, Jumyong, Jang, Aeni, Jung, HyunChul, Kim, Ilhwan, Kang, Dongwoo, Baek, Seungduk, Kim, Dae-Woo, Kang, Unbyung
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding