Laser assisted bonding (LAB) mechanism study on the effect of flux dipping, stage block vacuum force and chip attach misalignment
Kim, GaHyeon, Gim, MinHo, Na, SeokHo, Kim, WooJun, Bae, JoHyun, Ryu, DongSu, Park, DongJoo, Park, KyungRok
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Various Dicing Methods for Silicon Carbide Wafers
Jeon, YuJin, Na, SeokHo, Gim, MinSoo, Bae, JoHyun, Ryu, DongSu, Park, DongJoo, Park, KyungRok
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Metal Thermal Interface Material for the Next Generation FCBGA
Kim, YunAh, Bae, JoHyun, Jung, HyunHye, Choi, MiKyoung, Kweon, YoungDo, Ryu, DongSu, Park, DongJoo, Khim, JinYong
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding