Search Results - "BAE, JOHYUN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Laser assisted bonding (LAB) mechanism study on the effect of flux dipping, stage block vacuum force and chip attach misalignment

Laser assisted bonding (LAB) mechanism study on the effect of flux dipping, stage block vacuum force and chip attach misalignment

by Kim, GaHyeon, Gim, MinHo, Na, SeokHo, Kim, WooJun, Bae, JoHyun, Ryu, DongSu, Park, DongJoo, Park, KyungRok
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)

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Conference Proceeding

Various Dicing Methods for Silicon Carbide Wafers

Various Dicing Methods for Silicon Carbide Wafers

by Jeon, YuJin, Na, SeokHo, Gim, MinSoo, Bae, JoHyun, Ryu, DongSu, Park, DongJoo, Park, KyungRok
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)

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Conference Proceeding

Metal Thermal Interface Material for the Next Generation FCBGA

Metal Thermal Interface Material for the Next Generation FCBGA

by Kim, YunAh, Bae, JoHyun, Jung, HyunHye, Choi, MiKyoung, Kweon, YoungDo, Ryu, DongSu, Park, DongJoo, Khim, JinYong
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

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Conference Proceeding

Integrated circuit packaging system with fan-in package and method of manufacture thereof

Integrated circuit packaging system with fan-in package and method of manufacture thereof

by LEE SANGJIN, AHN SEUNGYUN, BAE JOHYUN
Year of Publication 28.07.2015

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Patent

Integrated circuit packaging system with package stacking

Integrated circuit packaging system with package stacking

by BAE JOHYUN, CHOI DAESIK, YOON IN SANG
Year of Publication 24.05.2016

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Patent

Integrated circuit packaging system with interposer and method of manufacture thereof

Integrated circuit packaging system with interposer and method of manufacture thereof

by CHOI A LEAM, YANG DEOKKYUNG, BAE JOHYUN
Year of Publication 15.04.2014

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Patent

Integrated circuit packaging system with encapsulation and method of manufacture thereof

Integrated circuit packaging system with encapsulation and method of manufacture thereof

by AHN SEUNGYUN, MUN SEONGHUN, BAE JOHYUN
Year of Publication 04.02.2014

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Patent

Integrated circuit packaging system with encapsulation and method of manufacture thereof

Integrated circuit packaging system with encapsulation and method of manufacture thereof

by PARK HYUNGSANG, CHOI A LEAM, BAE JOHYUN
Year of Publication 29.10.2013

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Patent

Integrated circuit package system with dual side connection and method for manufacturing thereof

Integrated circuit package system with dual side connection and method for manufacturing thereof

by SONG SUNGMIN, AHN SEUNGYUN, BAE JOHYUN
Year of Publication 06.08.2013

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Patent

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

by CHO SUNGWON, MOON DONGSOO, BAE JOHYUN, CHOI DAESIK
Year of Publication 28.07.2015

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Patent

Integrated circuit packaging system with rounded interconnect

Integrated circuit packaging system with rounded interconnect

by CHO SUNGWON, BAE JOHYUN, CHOI DAESIK
Year of Publication 11.06.2013

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Patent

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF

by CHOI A LEAM, YANG DEOKKYUNG, BAE JOHYUN
Year of Publication 21.03.2013

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Patent

Integrated circuit packaging system with stacked lead and method of manufacture thereof

Integrated circuit packaging system with stacked lead and method of manufacture thereof

by Jang, Ki Youn, Kim, YoungJoon, Bae, JoHyun
Year of Publication 06.11.2012

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Patent

Integrated circuit package system employing mold flash prevention technology

Integrated circuit package system employing mold flash prevention technology

by Jang, Ki Youn, Song, Sungmin, Bae, JoHyun
Year of Publication 28.08.2012

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Patent

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

by Choi, DaeSik, Bae, JoHyun, Shin, Junghoon
Year of Publication 31.07.2012

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Patent

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

by BAE JOHYUN, CHOI DAESIK, SHIN JUNGHOON
Year of Publication 31.07.2012

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Patent

Integrated circuit package system employing mold flash prevention technology

Integrated circuit package system employing mold flash prevention technology

by SONG SUNGMIN, JANG KI YOUN, BAE JOHYUN
Year of Publication 08.07.2014

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Patent

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT

by CHO SUNGWON, BAE JOHYUN, CHOI DAESIK
Year of Publication 02.02.2012

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Patent

Integrated circuit packaging system with stack device

Integrated circuit packaging system with stack device

by BAE JOHYUN, CHOI DAESIK, YOON IN SANG
Year of Publication 15.04.2014

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Patent

Integrated circuit package system with multi-chip module

Integrated circuit package system with multi-chip module

by HA JONG-WOO, SONG SUNGMIN, AHN SEUNGYUN, BAE JOHYUN
Year of Publication 03.05.2016

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Patent