Low thermal stress flip-chip package for Ultra Low-k die and lead-free bumps
Sawada, Y., Sato, M., Abe, T., Tokunaga, M., Baba, S., Hatanaka, Y.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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