Quasi-Flying Gate Concept Used for Short-Circuit Detection on SiC Power MOSFETs Based on a Dual-Port Gate Driver
Picot-Digoix, Mathis, Blaquiere, Frederic Richardeau Jean-Marc, Vinnac, Sebastien, Azzopardi, Stephane, Le, Thanh-Long
Published in IEEE transactions on power electronics (01.06.2023)
Published in IEEE transactions on power electronics (01.06.2023)
Get full text
Journal Article
Effect of short circuit aging on safe operating area of SiC MOSFET
Nguyen, Tien Anh, Lefebvre, Stéphane, Azzopardi, Stéphane
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
Get full text
Journal Article
Solid-state Circuit Breaker for aircraft high voltage DC network
Le, Thanh Long, Youssef, Toni, Azzopardi, Stephane, Lebey, Thierry, Lasserre, Philippe, Bruder, Arnaud, Lefebvre, Bruno
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
Get full text
Conference Proceeding
Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy
Sabbah, Wissam, Azzopardi, Stéphane, Buttay, Cyril, Meuret, Régis, Woirgard, Eric
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
Get full text
Journal Article
Conference Proceeding
Active Clamp Circuit for Online ON-State Voltage Measurement of High Voltage SiC MOSFETs Power Module
Laspeyres, Antoine, Descamps, Anne-Sophie, Batard, Christophe, Ginot, Nicolas, Le, Thanh-Long, Azzopardi, Stephane
Published in 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (19.03.2023)
Published in 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (19.03.2023)
Get full text
Conference Proceeding
Evaluation of Direct Printed Heat Sinks on Metallized Ceramic Substrate for High-Performance Power Modules
Khazaka, Rabih, Martin, Elodie, Alexis, Joel, Martineau, Donatien, Azzopardi, Stephane
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2021)
Get full text
Journal Article
Investigation on the Single Event Burnout Sensitive Volume Using Two-Photon Absorption Laser Testing
Darracq, Frédéric, Mbaye, Nogaye, Azzopardi, Stéphane, Pouget, Vincent, Lorfevre, Eric, Bezerra, Françoise, Lewis, Dean
Published in IEEE transactions on nuclear science (01.08.2012)
Published in IEEE transactions on nuclear science (01.08.2012)
Get full text
Journal Article
New Methodology for Defining Integration Limits Used for Switching Energy Computation in Power Devices
Oliveira, Joao, Cougo, Bernardo, Coccetti, Fabio, Azzopardi, Stephane, Morel, Herve
Published in 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (04.09.2023)
Published in 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (04.09.2023)
Get full text
Conference Proceeding
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity
Youssef, T., Rmili, W., Woirgard, E., Azzopardi, S., Vivet, N., Martineau, D., Meuret, R., Le Quilliec, G., Richard, C.
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
Get full text
Journal Article
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
Le Henaff, F., Azzopardi, S., Deletage, J.Y., Woirgard, E., Bontemps, S., Joguet, J.
Published in Microelectronics and reliability (01.09.2012)
Published in Microelectronics and reliability (01.09.2012)
Get full text
Journal Article
Conference Proceeding
Thickness Dependence of Epoxy-Based Composites with BaTiO₃ Particles on AC Electrical Breakdown Strength
Escriva, Arnaud, Diaham, Sombel, Bley, Vincent, Valdez-Nava, Zarel, Le, Trong Trung, Youssef, Toni, Khazaka, Rabih, Azzopardi, Stephane
Published in 2022 IEEE 4th International Conference on Dielectrics (ICD) (03.07.2022)
Published in 2022 IEEE 4th International Conference on Dielectrics (ICD) (03.07.2022)
Get full text
Conference Proceeding
New Investigation Possibilities on Forward Biased Power Devices Using Cross Sections
Kociniewski, T., Moussodji, J., Khatir, Z., Berkani, M., Lefebvre, S., Azzopardi, S.
Published in IEEE electron device letters (01.04.2012)
Published in IEEE electron device letters (01.04.2012)
Get full text
Journal Article