by Cai, Fuxi, Yen, She-Hwa, Uppala, Apurva, Thomas, Luke, Liu, Tianchi, Fu, Peter, Zhang, Xiaofeng, Low, Ambrose, Kamalanathan, Deepak, Hsu, Joe, Ayyagari-Sangamalli, Buvna
Published in Advanced intelligent systems (01.08.2022)

by Bazizi, El Mehdi, Pal, Ashish, Kim, Jongchol, Jiang, Liu, Reddy, Vinod, Alexander, Blessy, Ayyagari-Sangamalli, Buvna
Published in IEEE transactions on electron devices (01.11.2021)

by Vyas, Pratik B., Pal, Ashish, Weeks, Stephen, Holt, Joshua, Srivastava, Aseem K., Megalini, Ludovico, Krishnan, Siddarth, Chudzik, Michael, Bazizi, El Mehdi, Ayyagari-Sangamalli, Buvna
Published in Solid-state electronics (01.02.2023)

by Vyas, Pratik B., Zhao, Charisse, Dag, Sefa, Pal, Ashish, Bazizi, El Mehdi, Ayyagari-Sangamalli, Buvna
Published in 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (27.09.2023)

by Jiang, Liu, Pal, Ashish, Bazizi, El Mehdi, Saremi, Mehdi, Ren, He, Alexander, Blessy, Ayyagari-Sangamalli, Buvna
Published in 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (23.09.2020)

by Pal, Ashish, Bazizi, El Mehdi, Colombeau, Benjamin, Alexander, Blessy, Ayyagari-Sangamalli, Buvna
Published in 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (27.09.2021)

by Pal, Ashish, Bazizi, El Mehdi, Jiang, Liu, Saremi, Mehdi, Alexander, Blessy, Ayyagari-Sangamalli, Buvna
Published in 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (23.09.2020)

by Vyas, Pratik B., Pal, Ashish, Costrini, Gregory, Asenov, Plamen, Mhedhbi, Sarra, Zhao, Charisse, Moroz, Victor, Colombeau, Benjamin, Haran, Bala, Bazizi, El Mehdi, Ayyagari-Sangamalli, Buvna
Published in 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (27.09.2023)

by Saremi, Mehdi, Pal, Ashish, Jiang, Liu, Bazizi, El Mehdi, Lee, Helen, Lin, Xi-Wei, Alexander, Blessy, Ayyagari-Sangamalli, Buvna
Published in 2020 Device Research Conference (DRC) (01.06.2020)

by Sitaraman, Srikrishna, Verhaverbeke, Steven, Banna, Samer, Sowwan, Mukhles, Jiang, Liu, Bazizi, El Mehdi, Ayyagari-Sangamalli, Buvna
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Dag, Sefa, Liu, Ming, Jiang, Liu, Kiaee, Amir, See, Gilbert, Lianto, Prayudi, Ayyagari-Sangamalli, Buvna, Bazizi, El Mehdi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Dag, Sefa, Jiang, Liu, Lianto, Prayudi, See, Gilbert, An, Jinho, Sreenivasan, Raghav, Sundarajjan, Arvind, Ayyagari-Sangamalli, Buvna, Bazizi, El Mehdi
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)

by Sitaraman, Srikrishna, Jiang, Liu, Dag, Sefa, Masoomi, Mohammad, Wang, Ying, Lianto, Prayudi, An, Jinho, Wang, Ruiping, See, Gilbert, Sundarrajan, Arvind, Bazizi, El Mehdi, Ayyagari-Sangamalli, Buvna
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Pal, Ashish, Thareja, Gaurav, Dag, Sefa, Costrini, Gregory, Reddy, Vinod, Xu, Yi, Lei, Yu, Zhang, Aixi, Shen, Gang, Jansen, Alexander, Chen, Zhebo, Gage, Max, Tang, Jianshe, Yang, Yen-Chu, Deshpande, Sameer, Huey, Sidney, Hung, Raymond, Jiang, Hao, Cai, Man-Ping, Abramovitz, Yaniv, Engel, Lior, Naik, Mehul, Wang, Rongjun, Kesapragada, Sree, Ayyagari-Sangamalli, Buvna, Tang, Xianmin, Bazizi, El Mehdi
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)