by Klipstein, P. C., Avnon, E., Benny, Y., Cohen, Y., Fraenkel, R., Gliksman, S., Glozman, A., Hojman, E., Klin, O., Krasovitsky, L., Langof, L., Lukomsky, I., Marderfeld, I., Yaron, N., Nitzani, M., Rappaport, N., Shtrichman, I., Snapi, N., Weiss, E.
Published in Journal of electronic materials (01.10.2018)

by Klipstein, P. C., Avnon, E., Benny, Y., Berkowicz, E., Cohen, Y., Dobromislin, R., Fraenkel, R., Gershon, G., Glozman, A., Hojman, E., Ilan, E., Karni, Y., Klin, O., Kodriano, Y., Krasovitsky, L., Langof, L., Lukomsky, I., Nevo, I., Nitzani, M., Pivnik, I., Rappaport, N., Rosenberg, O., Shtrichman, I., Shkedy, L., Snapi, N., Talmor, R., Tessler, R., Weiss, E., Tuito, A.
Published in Journal of electronic materials (01.09.2017)

by Klipstein, P.C., Avnon, E., Benny, Y., Fraenkel, A., Glozman, A., Hojman, E., Ilan, E., Kahanov, E., Klin, O., Krasovitski, L., Langof, L., Lukomsky, I., Nitzani, M., Shkedy, L., Shtrichman, I., Snapi, N., Talmor, R., Tuito, A., Vaserman, S., Weiss, E.
Published in Defense science journal (01.03.2017)