150-GHz RF SOI-CMOS Technology in Ultrathin Regime on Organic Substrate
Lecavelier des Etangs-Levallois, Aurélien, Dubois, E., Lesecq, M., Danneville, F., Poulain, L., Tagro, Y., Lepilliet, S., Gloria, D., Raynaud, C., Troadec, D.
Published in IEEE electron device letters (01.11.2011)
Published in IEEE electron device letters (01.11.2011)
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Journal Article
Energy-Band Engineering for Improved Charge Retention in Fully Self-Aligned Double Floating-Gate Single-Electron Memories
Tang, Xiaohui, Krzeminski, Christophe, Lecavelier des Etangs-Levallois, Aurélien, Chen, Zhenkun, Dubois, Emmanuel, Kasper, Erich, Karmous, Alim, Reckinger, Nicolas, Flandre, Denis, Francis, Laurent A, Colinge, Jean-Pierre, Raskin, Jean-Pierre
Published in Nano letters (09.11.2011)
Published in Nano letters (09.11.2011)
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Journal Article
Characterization of flexible CMOS technology tranferred onto a metallic foil
Philippe, Justine, Lecavelier des Etangs-Levallois, Aurelien, Latzel, Philip, Danneville, Francois, Robillarcf, Jean-Francois, Gloria, Daniel, Dubois, Emmanuel
Published in EUROSOI-ULIS 2015: 2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (01.01.2015)
Published in EUROSOI-ULIS 2015: 2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (01.01.2015)
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Conference Proceeding
Energy-band engineering for improved charge retention in fully self-aligned double floating-gate single-electron memories
Tang, Xiaohui, Krzeminski, Christophe, Aurélien Lecavelier des Etangs-Levallois, Chen, Zhenkun, Dubois, Emmanuel, Kasper, Erich, Alim Karmous, Reckinger, Nicolas, Flandre, Denis, Francis, Laurent A, Colinge, Jean-Pierre, Raskin, Jean-Pierre
Published in arXiv.org (15.11.2011)
Published in arXiv.org (15.11.2011)
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Paper
Journal Article
Importance of Creep Fatigue Interaction in Reliability of Solder Joints
Zanella, Stephane, Etangs-Levallois, Aurelien Lecavelier des, Charkaluk, Eric, Filho, Wilson Carlos Maia, Constantinescu, Andrei
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Merging of packaging technologies for highly integrated embedded modules
Schwarz, Timo, Stahr, Hannes, Cardoso, Andre, Fernandes, Elisabete, Lecavelier Des Etangs-Levallois, Aurelien, Brizoux, Michel
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications
Lecavelier des Etangs-Levallois, Aurelien, Grivon, A., Baudet, D., Maia, W. C., Brizoux, M.
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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Conference Proceeding
Fruit i.e. apple, and vegetable peeler, has blades placed at interior of cavities of semi-spheres, respectively, and measuring quarter of circumference of fruit or vegetable, where blades are adapted to geometry of fruit or vegetable
SOUFFAY SOPHIE, BOURASS MEHDI, DELABRE SANDRA, URFIN PIERRE EMMANUEL, TRINH VAN NGA, LECAVELIER DES ETANGS LEVALLOIS AURELIEN, ROZO ORTEGA KAREN MELISSA
Year of Publication 20.11.2009
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Year of Publication 20.11.2009
Patent