Stress voiding and electromigration phenomena in aluminum alloys
Kordic, S., Augur, R.A., Dirks, A.G., Wolters, R.A.M.
Published in Applied surface science (01.10.1995)
Published in Applied surface science (01.10.1995)
Get full text
Journal Article
Conference Proceeding
AlSiV and AlSiVPd films as alternatives for AlSiCu interconnect: microstructure and its impact on reliability
Get full text
Journal Article
Conference Proceeding
Annealing impact on damascene Cu resistivity and microstructures
Qing-Tang Jiang, Ming-Hsing Tsai, Frank, A., Parihar, V., Nowell, M., Augur, R.A., Havemann, R.H., Luttmer, J.D.
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)
Published in 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) (2001)
Get full text
Conference Proceeding
A 25 mu m/sup 2/ bulk full CMOS SRAM cell technology with fully overlapping contacts
Verhaar, R.D.J., Augur, R.A., Aussems, C.N.A., de Bruin, L., Op den Buijsch, F.A.M., Dingen, L.W.M., Geuns, T.C.T., Havermans, W.J.M., Montree, A.H., van der Plas, P.A., Pomp, H.G., Vertregt, M., de Werdt, R., Wils, N.A.H., Woerlee, P.H.
Published in International Technical Digest on Electron Devices (1990)
Published in International Technical Digest on Electron Devices (1990)
Get full text
Conference Proceeding
A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips
Hopper, A., Jones, A., Augur, R.A., Fice, M.J., Blythe, S., Ahmed, H.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1992)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1992)
Get full text
Journal Article