Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems
Vogel, Dietmar, Auersperg, Jürgen, Michel, Bernd
Published in Advanced engineering materials (01.04.2009)
Published in Advanced engineering materials (01.04.2009)
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Journal Article
Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, Jan, Dudek, Rainer, Auersperg, Jurgen, Pantou, Remi, Rzepka, Sven
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, Eberhard, Auersperg, Jurgen, Breuer, Dirk, Bramer, Birgit, Rzepka, Sven
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding
Parametric Approach to Numerical Design for Optimization of Stacked Packages
Dowhan, Lukasz, Wymyslowski, Artur, Dudek, Rainer, Auersperg, Jurgen
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding
Combined Fracture, Delamination Risk and Fatigue Evaluation of Advanced Microelectronics Applications towards RSM/DOE Concepts
Auersperg, J., Dudek, R., Michel, B.
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
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Conference Proceeding
Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B., Auersperg, J., Grosser, V., Kaulfersch, E., Wittler, O., Michel, B.
Published in Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003 (2003)
Published in Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003 (2003)
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Conference Proceeding
Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J., Kieselstein, E., Schubert, A., Michel, B.
Published in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) (2001)
Published in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) (2001)
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Conference Proceeding
Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O., Sprafke, P., Auersperg, J., Michel, B., Reichl, H.
Published in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) (2001)
Published in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) (2001)
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Conference Proceeding
CHIP ARRANGEMENT AND METHOD FOR THE PRODUCTION OF THE SAME
JUNG, ERIK, ASCHENBRENNER, ROLF, KLOESER, JOACHIM, SIMON, JUERGEN, REICHL, HERBERT, AUERSPERG, JUERGEN
Year of Publication 17.09.1998
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Year of Publication 17.09.1998
Patent