Towards a Robust Design of Electronics Assemblies under Fracture, Delamination and Fatigue Aspects
Auersperg, J., Michel, B.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems
Vogel, Dietmar, Auersperg, Jürgen, Michel, Bernd
Published in Advanced engineering materials (01.04.2009)
Published in Advanced engineering materials (01.04.2009)
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Journal Article
BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
Auersperg, Juergen, Auerswald, Ellen, Vogel, Dietmar, Rzepka, Sven
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Thin film adhesion measurement by nanoindentation: Review of methodologies and validation by means of finite element simulations
Albrecht, Jan, Weissbach, Marie, Auersperg, Juergen, Dudek, Rainer, Kaulfersch, Eberhard, Rzepka, Sven
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, Dietmar, Auerswald, Ellen, Auersperg, Juergen, Rzepka, Sven
Published in 2015 China Semiconductor Technology International Conference (01.03.2015)
Published in 2015 China Semiconductor Technology International Conference (01.03.2015)
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Conference Proceeding
Journal Article
Advantage and current limitations of advanced fracture mechanics for 3d-integration and beol under CPI aspects
Auersperg, Juergen, Dudek, Rainer, Rzepka, Sven, Michel, Bernd
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J., Vogel, D., Auerswald, E., Rzepka, S., Michel, B.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Experimental and numerical methods for evaluation of interface cracks in electronics systems
Keller, J., Schulz, M., Wunderle, B., Auersperg, J., Michel, B.
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
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Conference Proceeding
Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, Rainer, Walter, Hans, Auersperg, Juergen, Michel, Bernd
Published in Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics (01.01.2007)
Published in Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics (01.01.2007)
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Conference Proceeding
Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, Artur, Wittler, O., Mrossko, R., Dudek, Rainer, Auersperg, Juergen, Dowhan, Lukasz
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Parametric Approach to Numerical Design for Optimization of Stacked Packages
Dowhan, Lukasz, Wymyslowski, Artur, Dudek, Rainer, Auersperg, Jurgen
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding