Empirical BEOL-TDDB evaluation based on I(t)-trace analysis
Aubel, O., Beyer, A., Talut, G., Gall, M.
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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Conference Proceeding
76. Circulating tumor cells in patients undergoing radical cystectomy for muscle-invasive bladder cancer: Interim results of the CirGuidance study
Boormans, J, Beije, N, Sleijfer, S, Van, N, Martens, J, Klaver, S, De Vries, P, Somford, R, Van der Heijden, A, Van Aubel, O, Van der Hoeven, J, Slaa, E. Te, Wijburg, C
Published in European journal of surgical oncology (01.09.2016)
Published in European journal of surgical oncology (01.09.2016)
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Journal Article
Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
Hauschildt, M., Hennesthal, C., Talut, G., Aubel, O., Gall, M., Yeap, K. B., Zschech, E.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Bělský, P., Streiter, R., Wolf, H., Schulz, S.E., Aubel, O., Gessner, T.
Published in Microelectronic engineering (01.04.2012)
Published in Microelectronic engineering (01.04.2012)
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Copper–dielectric cap interface with enhanced reliability for 45 nm technology and beyond
Hohage, J., Mayer, U., Lehr, M.U., Feustel, F., Aubel, O., Hennesthal, C.
Published in Microelectronic engineering (01.11.2010)
Published in Microelectronic engineering (01.11.2010)
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Journal Article
Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node
Zhang, L, Zhou, J P, Im, J, Ho, P S, Aubel, O, Hennesthal, C, Zschech, E
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
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Extensive investigations of temperature influence on barrier integrity during reliability testing
Aubel, O., Meyer, M.A., Feustel, F., Engelmann, H.J., Zienert, I., Poppe, J., Schmidt, H., Gehre, D., Geisler, H., Langer, E., Limbecker, P., Foltyn, T., Witt, C., Yao, W., Thierbach, S., Koschinsky, F., Zistl, C.
Published in Microelectronic engineering (01.10.2008)
Published in Microelectronic engineering (01.10.2008)
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Eerste ervaringen prostaatkankerbehandeling met High Intensity Focused Ultrasound (HIFU) in Nederland
van Aubel, O. G. J. M., Langbein, S., Jansen, H.
Published in Tijdschrift voor urologie (01.02.2012)
Published in Tijdschrift voor urologie (01.02.2012)
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Journal Article
Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
Zhang, L, Kraatz, M, Aubel, O, Hennesthal, C, Im, J, Zschech, E, Ho, P S
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Integration Aspects of CoWP Capping Layers for Electromigration Enhancement
Preusse, A., Seidel, R., Aubel, O., Nopper, M., Freudenberg, B., Schaller, M., Fecher, M., Letz, T., Bartsch, C., Ott, A., Friedemann, M., Feustel, F., Meyer, M.A., Limbecker, P.
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding
Model for the barrier diffusion into Cu interconnects at high temperatures
Aubel, Oliver, Hasse, Wolfgang, Hommel, Martina, Koerner, Heinrich
Published in Microelectronic engineering (01.12.2005)
Published in Microelectronic engineering (01.12.2005)
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Comprehensive characterization of BEOL-TDDB performance using very fast Voltage ramp Dielectric Breakdown tests
Aubel, O., Feustel, F., Hoffmann, T., Majer, M., Yiang, K.
Published in 2009 IEEE International Integrated Reliability Workshop Final Report (01.10.2009)
Published in 2009 IEEE International Integrated Reliability Workshop Final Report (01.10.2009)
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The Evolution of Barrier Properties During Reliability Testing of Cu Interconnects
Meyer, M A, Aubel, O, Feustef, F, Engelmann, H J, Zienerf, I, Poppe, J, Gehre, D, Witt, C
Published in AIP conference proceedings (07.11.2008)
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Published in AIP conference proceedings (07.11.2008)
Journal Article
A simple electrical method for etch bias and process reliability determination
Kok-Yong Yiang, Chin, M, Marathe, A, Aubel, O
Published in 2010 IEEE International Reliability Physics Symposium (01.01.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.01.2010)
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