Handling of ultra-thin dies with fine pitch micro-bumps for advanced packaging applications
Hajdarevic, Zlatko, Malachowski, Karl, Attard, Alastair
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding
Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices
Visser Taklo, Maaike M., Wright, Daniel Nilsen, Vardoy, Astrid-Sofie, Attard, Alastair, Hajdarevic, Zlatko, Bulacher, Stephan, Saliba, Mario, Wijgaerts, Jan, Borg, Joshua, Vella, David Oscar
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding